| AAPL_83d35ff4 | this fall | 2026-09-01 | 2026-11-30 | Apple releases new child safety features, such as Ask to Browse and Time Allowances, along with major updates across its operating systems. | These updates enhance user experience, reinforce Apple's commitment to privacy and safety, and could drive engagement and device upgrades across its installed base. | Ticker | 2026-07-30 | earnings_transcript | AAPL (ticker) |
| AVGO_d6960b6c | Q4 2026 | 2026-09-01 | 2026-11-30 | Ramp up of high-volume shipments of TPU version 8i to Google, accelerated shipments of Ironwood to Anthropic, continued shipments of Jalapeno for OpenAI, and production shipments of Meta's custom MTIA accelerator. | These deployments are expected to drive Q4 AI revenue to $21.7 billion, up 236% year-on-year, demonstrating strong execution and demand in their key AI semiconductor business. | Ticker | 2026-09-02 | earnings_transcript | AVGO (ticker) |
| AVGO_3121e94d | production late 2026 | 2026-10-01 | 2026-12-31 | Broadcom beginning production of silicon for OpenAI's AI accelerators. | This marks a significant milestone in Broadcom's partnership with OpenAI, a major AI frontier lab, and is crucial for its projected AI semiconductor revenue growth in 2027 and beyond. | Ticker | 2026-06-03 | earnings_transcript | AVGO (ticker) |
| AVGO_f8456d4a | delivery in late 2026 | 2026-10-01 | 2026-12-31 | Execution and delivery of an $11 billion order of TPU 'ironwood' racks to Anthropic (management stated the $11B order is for delivery in late 2026). | Successful on-time delivery drives revenue recognition, backlog conversion and AI semiconductor/networks revenue in 2026; delays, cancellations or supply constraints would reduce near-term revenue and could worsen concentration risk and investor sentiment. | Ticker | 2025-12-11 | earnings_transcript | AVGO (ticker) |
| AVGO_98b78f53 | delivery in late 2026 | 2026-10-01 | 2026-12-31 | Delivery and execution of a $1 billion order from Broadcom's fifth XPU (customer accelerator) customer, noted as for delivery in late 2026. | Adds to AI backlog conversion and customer diversification; on-time execution supports FY2026 revenue and cementing design-win momentum, while delays or cancellations would reduce expected AI revenue and weaken investor confidence in broadening customer base. | Ticker | 2025-12-11 | earnings_transcript | AVGO (ticker) |
| AVGO_c6986cdd | for 2026 through 2028 | 2026-01-01 | 2028-12-31 | Broadcom has fully secured capacity for leading-edge wafers, high-bandwidth memory and substrates for 2026–2028. | Mitigates supply constraints risk and provides visibility into delivery timelines and backlog, supporting investor confidence in growth trajectory. | Ticker | 2026-03-04 | earnings_transcript | AVGO (ticker) |
| AVGO_539a5499 | fiscal year 27 | 2026-11-01 | 2027-10-31 | Broadcom's actual AI semiconductor revenue for fiscal year 2027 compared to its reiterated guidance of 'in excess of $100 billion'. | This ambitious long-term target is a major driver of Broadcom's valuation. Achieving or exceeding it would be a significant bullish catalyst, while any shortfall could materially impact investor sentiment. | Ticker | 2026-06-03 | earnings_transcript | AVGO (ticker) |
| TSM_85eaf174 | first half of 2027 | 2027-01-01 | 2027-06-30 | Volume production for TSMC's new 3nm fab in Tainan Science Park is well on track to begin. | This milestone significantly increases 3nm capacity in Taiwan, crucial for meeting robust customer demand and reinforcing TSMC's manufacturing leadership and revenue growth. | Ticker | 2026-10-15 | earnings_transcript | TSM (ticker) |
| TSM_3e406e44 | first half of 2027 | 2027-01-01 | 2027-06-30 | Volume production of the new 3-nanometer fab in Tainan Science Park, Taiwan. | This is a bullish factor, as it will increase N3 capacity to meet strong AI demand and support future revenue growth. | Ticker | 2026-04-16 | earnings_transcript | TSM (ticker) |
| TSM_9b9acdbe | first half of 2027 | 2027-01-01 | 2027-06-30 | Volume production commencement for the new 3-nanometer fab in Tainan Science Park. | This milestone will increase 3nm capacity, addressing strong AI-driven demand and potentially boosting revenue for TSMC. | Ticker | 2026-04-15 | earnings_transcript | TSM (ticker) |
| TSM_3a42201a | next-generation LPU | 2027-01-01 | 2029-12-31 | TSMC securing manufacturing business for a customer's next-generation LPU (Logic Processing Unit) product. | Bullish for market share and revenue if successful, demonstrating continued technology leadership and customer trust in a competitive segment. | Ticker | 2026-04-16 | earnings_transcript | TSM (ticker) |
| AVGO_2a830b86 | 2027 through 2029 | 2027-01-01 | 2029-12-31 | Execution of the multi‑year alignment/agreement with OpenAI to support ~10 gigawatts of capacity across the 2027–2029 timeframe (management referenced the 10 GW alignment running through '27–'29). | If executed as anticipated, this multi-year power/build program could represent a material multi-year demand stream for Broadcom systems/components; if it under‑delivers or is delayed, expected medium-term revenue and visibility into large hyperscaler demand would be impaired. | Ticker | 2025-12-11 | earnings_transcript | AVGO (ticker) |
| AVGO_bfe6a053 | in excess of $100 billion in 2027 | 2027-01-01 | 2027-12-31 | Broadcom management stated line-of-sight to AI revenue from chips, just chips, exceeding $100 billion in 2027. | If realized, it represents a multi-year, high-scale AI compute monetization that could meaningfully lift revenue and inform valuation, though it may pressure margins if AI mix grows faster than mix shifts in other segments. | Ticker | 2026-03-04 | earnings_transcript | AVGO (ticker) |
| AVGO_6fd62a9a | in 2027 | 2027-01-01 | 2027-12-31 | OpenAI deploying in volume their first-generation XPU in 2027 at over 1 gigawatt of compute capacity. | OpenAI demand is a key driver for Broadcom's XPUs; a meaningful ramp would support backlog realization and top-line growth, though execution risk and timing remain uncertain. | Ticker | 2026-03-04 | earnings_transcript | AVGO (ticker) |
| AVGO_ed84ae9b | in 2027 | 2027-01-01 | 2027-12-31 | Next-generation Tomahawk 7 switch featuring 2x the performance. | Higher bandwidth networking leadership supports AI compute expansion and could accelerate share gains in AI networking. | Ticker | 2026-03-04 | earnings_transcript | AVGO (ticker) |
| TSM_91640f5f | about another one year to be mature so we can put it into the production with our customer. | 2027-07-01 | 2027-07-31 | CoWoS pilot line reaching maturity for production. | This milestone would enable TSMC to address the tight advanced packaging capacity, supporting customer growth in AI and HPC, and potentially alleviating a key bottleneck for future revenue. | Ticker | 2026-07-16 | earnings_transcript | TSM (ticker) |
| TSM_37699d9f | third quarter 2027 | 2027-07-01 | 2027-09-30 | Volume production will begin at TSMC's second 3nm fab in Arizona, slightly ahead of the previous schedule. | This accelerates overseas capacity expansion, addressing strong customer demand in the U.S. and potentially mitigating geopolitical supply chain risks. | Ticker | 2026-10-15 | earnings_transcript | TSM (ticker) |
| AVGO_c74214d3 | in 2028 | 2028-01-01 | 2028-12-31 | Next-step upgrade to 400G SerDes in 2028. | 400G SerDes upgrade enables higher bandwidth within data-center clusters; could influence ASPs, mix and gross margins during the transition period. | Ticker | 2026-03-04 | earnings_transcript | AVGO (ticker) |