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Fiscal Spend '26: U.S. Chip Manufacturing Watchlist (view performance)
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Theme no thesis · 1/5 sections · Tickers 15 with notes · 1 pending
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| Catalyst | Estimated Timing | Estimated Date Start | Estimated Date End | Why It Matters | Ticker Or Theme Specific | Source Types | Contributing Tickers | Mention Count | Base Score | Source Weight | Specificity Weight | Macro Bridge | Macro Bridge Multiplier | Theme Score | Date Aggregated | Manual Override | Bridge Mention Count | Theme Base Score | Theme Importance Score | Catalyst Source | Catalyst ID | Transcript Date | Source Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| The U.S. Department of Commerce continues to announce significant CHIPS Act funding awards and disbursements, providing crucial capital for companies expanding semiconductor manufacturing and supply chain capabilities in the United States. | Ongoing through 2026 | 2026-07-15 | 2026-12-31 | This directly fuels the "Fiscal Spend '26" theme by providing capital for new fabs, equipment, and R&D, impacting a wide range of constituent tickers and bolstering domestic chip production and supply chain resilience. | Theme | theme_composer | INTC, MU, TSM, 005930.KO, TXN, AMKR, GFS, ENTG, 000660.KO, 6488.TWO, AMAT, COHR, SKYT, GLW, XFAB.PA, WOLF | 16 | 0.0162 | 1.18 | 0.92 | Regulatory/Policy | 1.35 | 2.376 | 2026-07-15 | False | 1 | 3.1243 | 457.8843 | Theme composer | |||
| Amkor's Arizona advanced packaging and test facility is on track for Phase 1 completion in 2027, with a new High-Density Fan-Out (HDFO) data center CPU program ramping in Q3 2026, contributing meaningful revenue and nearly tripling AI advanced packaging revenue in 2026. | Q3 2026 - 2027 | 2026-07-01 | 2027-12-31 | The successful ramp of this facility and its advanced packaging technologies addresses a critical gap in the U.S. semiconductor supply chain, particularly for AI chips, enhancing domestic manufacturing capabilities and offering diversified regional options. | Ticker | theme_composer | AMKR, INTC, AMAT, 000660.KO | 4 | 0.0034 | 1.18 | 0.85 | 1.0 | 0.3417 | 2026-07-15 | False | 1 | 0.6284 | 63.0275 | Theme composer | ||||
| Launch of Intelligent eyewear, bringing a new form factor experience for the AI era. | later this year | 2026-08-06 | 2026-12-31 | This expands Samsung's premium product portfolio and introduces a new AI-enabled device, potentially driving market share growth and enhancing the AI experience across the Galaxy ecosystem. | Ticker | 005930.KO (ticker) | 005930.KO_8f34c55b | 2026-07-30 | earnings_transcript | ||||||||||||||
| HBM4 sales are expected to increase by more than three times quarter-on-quarter, with HBM4 accounting for well over 60% of the total HBM revenue mix in the second half of 2026. | in the third quarter | 2026-07-01 | 2026-09-30 | This indicates strong execution and market leadership in high-value HBM, crucial for AI demand and overall memory profitability, aiming for HBM market share broadly in line with overall DRAM market share. | Ticker | 005930.KO (ticker) | 005930.KO_b4e4550b | 2026-07-30 | earnings_transcript | ||||||||||||||
| Corning achieving its Q3 2026 sales guidance of $4.9 billion to $5 billion and core EPS guidance of $0.85 to $0.89. | In the third quarter | 2026-07-01 | 2026-09-30 | Meeting or exceeding this guidance would demonstrate continued strong operational performance and momentum, particularly in high-growth areas like optical communications. | Ticker | GLW (ticker) | GLW_eaeb96b6 | 2026-07-28 | earnings_transcript | ||||||||||||||
| Launch and competitive performance of Coral Rapid server CPUs with multithreading capabilities. | coming up strong | 2026-07-01 | 2027-12-31 | A successful launch of Coral Rapid with strong competitive performance against AMD is critical for Intel to regain or maintain market share in the server CPU segment and capitalize on AI-driven demand. | Ticker | INTC (ticker) | INTC_95cf6a9a | 2026-04-23 | earnings_transcript | ||||||||||||||
| Weakening PC demand in the second half of 2026, leading to a low double-digit decline in full-year PC unit Total Addressable Market (TAM). | second half of the year | 2026-07-01 | 2026-12-31 | Weak PC demand directly impacts CCG revenue and overall company performance; a worse-than-expected decline would be bearish, while resilience would be bullish. | Theme | INTC (ticker) | INTC_4412bd7b | 2026-04-23 | earnings_transcript | ||||||||||||||
| Sustained strong double-digit unit growth in server CPU demand for the industry and Intel, with momentum continuing into 2027. | strong year of double-digit unit growth for the industry and for us with momentum extending into 2027 | 2026-01-01 | 2027-12-31 | Robust server CPU demand, driven by AI infrastructure build-out, is a significant tailwind for Intel's Data Center and AI segment, positively impacting revenue and market position. | Ticker | INTC (ticker) | INTC_d4d9e998 | 2026-04-23 | earnings_transcript | ||||||||||||||
| Applied Materials expects to achieve fiscal Q4 2026 revenue of $10.25 billion (midpoint) and non-GAAP EPS of $4.02 (midpoint). | Fiscal Q4 2026 (ending October 2026) | 2026-08-01 | 2026-10-31 | Meeting or exceeding this strong guidance would validate the company's positive outlook and the impact of AI-driven demand on its financial performance, potentially boosting investor confidence. | Ticker | AMAT (ticker) | AMAT_ff30d09b | 2026-08-13 | earnings_transcript | ||||||||||||||
| Computing revenue is expected to accelerate to nearly 30% sequentially in Q3, driven by AI data center demand and the HDFO CPU ramp. | in Q3 | 2026-07-01 | 2026-09-30 | This signifies strong demand for Amkor's high-value advanced packaging in AI/HPC, directly impacting revenue mix and profitability. | Ticker | AMKR (ticker) | AMKR_215e97a3 | 2026-07-27 | earnings_transcript | ||||||||||||||
| Revenue in the Automotive and Industrial end market is expected to grow mid-single digits sequentially in Q3. | in Q3 | 2026-07-01 | 2026-09-30 | This highlights sustained demand for advanced packaging in key growth areas like ADAS and next-generation vehicle platforms. | Ticker | AMKR (ticker) | AMKR_cde98ef4 | 2026-07-27 | earnings_transcript | ||||||||||||||
| Consumer revenue is expected to grow in the mid-teens percent sequentially in Q3, driven by continued strength in IoT demand. | in Q3 | 2026-07-01 | 2026-09-30 | This indicates a recovery in consumer demand and strength in IoT applications, contributing to Amkor's broad-based growth. | Ticker | AMKR (ticker) | AMKR_e588e489 | 2026-07-27 | earnings_transcript | ||||||||||||||
| Amkor to launch two new High-Density Fan-Out (HDFO) programs for AI data centers into high-volume production in Korea. | second half of the year | 2026-07-01 | 2026-12-31 | This is critical for Amkor to achieve its projected nearly tripling of HDFO/2.5D revenue in 2026 and capitalize on AI/HPC demand, significantly impacting computing segment growth and overall revenue. | Ticker | AMKR (ticker) | AMKR_525e36ea | 2026-02-09 | earnings_transcript | ||||||||||||||
| Amkor to meet construction milestones for Phase One of its Arizona advanced packaging campus, with building completion targeted for mid-2027. | meeting construction milestones of our Arizona facility | 2026-01-01 | 2027-06-30 | On-time construction is crucial for establishing a U.S. domestic supply chain for advanced packaging, securing future customer engagements, and realizing the long-term strategic benefits of the facility. | Ticker | AMKR (ticker) | AMKR_6ce2607d | 2026-02-09 | earnings_transcript | ||||||||||||||
| Amkor to resolve R&D and New Product Introduction (NPI) constraints in Korea to effectively prioritize and support larger advanced packaging opportunities. | ongoing in 2026 | 2026-01-01 | 2026-12-31 | Overcoming these constraints is crucial for Amkor to maximize its capacity utilization, accelerate new program qualifications, and fully capture the strong demand in advanced packaging, particularly for AI/HPC. | Ticker | AMKR (ticker) | AMKR_9fd37444 | 2026-02-09 | earnings_transcript | ||||||||||||||
| Amkor to continue the profitable ramp-up of its Vietnam facility, including the successful migration of SiP products from Korea. | continuing in Q1 | 2026-01-01 | 2026-12-31 | Continued profitability and efficient migration in Vietnam are key to recovering the 90 basis point gross margin headwind from 2025 and freeing up valuable manufacturing space in Korea for HDFO and test growth. | Ticker | AMKR (ticker) | AMKR_283095f1 | 2026-02-09 | earnings_transcript | ||||||||||||||
| Changes or new developments in export controls and trade policies, particularly between the U.S. and China, affecting AI products or semiconductor supply chains. | closely monitoring | 2026-05-03 | 2027-05-03 | Could impact demand, supply chain dynamics, and market access for certain products, potentially affecting revenue or operational flexibility. | Theme | AMKR (ticker) | AMKR_c57c3b02 | 2026-04-27 | earnings_transcript | ||||||||||||||
| High-volume ramp of advanced packaging programs, including the new data center CPU program, in Korea. | second half of the year | 2026-07-01 | 2026-12-31 | Successful ramps are crucial for achieving full-year revenue growth targets, especially the tripling of AI advanced packaging revenue, and improving utilization and margins. Delays would negatively impact results and sentiment. | Ticker | AMKR (ticker) | AMKR_9c6e7aec | 2026-04-27 | earnings_transcript | ||||||||||||||
| Receipt of the remaining direct funding from the CHIPS Act, out of the 'up to $1.6 billion' agreement, as Texas Instruments fulfills various milestones. | over the coming years | 2026-04-24 | 2029-04-24 | This additional funding provides non-dilutive capital for Texas Instruments' manufacturing investments, supporting capacity expansion and potentially enhancing free cash flow. | Ticker | TXN (ticker) | TXN_5449e75a | 2026-04-22 | earnings_transcript | ||||||||||||||
| Trend of inventory days towards the lower end of TI's 150-250 day target range. | during an upturn | 2026-07-08 | 2027-06-30 | A decrease in inventory days indicates robust demand absorption and efficient supply chain management, which is bullish. An increase or stable high levels could signal weakening demand. | Ticker | TXN (ticker) | TXN_bce0ae09 | 2026-04-22 | earnings_transcript | ||||||||||||||
| Texas Instruments' ability to implement price increases in the second half of 2026, contingent on sustained strong demand signals. | second half of the year | 2026-07-01 | 2026-12-31 | If demand remains robust, successful price increases could materially improve gross margins and overall profitability for Texas Instruments. | Ticker | TXN (ticker) | TXN_fa8d3238 | 2026-04-22 | earnings_transcript | ||||||||||||||
| Coherent expects to achieve its goal of doubling internal 6-inch indium phosphide output capacity. | by the end of next quarter, which is 1 quarter earlier than we thought | 2026-09-30 | 2026-09-30 | This milestone is crucial for alleviating supply constraints, lowering manufacturing costs, and is anticipated to drive gross margin expansion and accelerate revenue growth across high-demand product lines like transceivers and CPO. | Ticker | COHR (ticker) | COHR_edc4f770 | 2026-05-06 | earnings_transcript | ||||||||||||||
| Intel Foundry expects design commitments for its 14A process node in late 2026/early 2027, alongside the conversion of its multi-billion dollar advanced packaging backlog into revenue starting in 2027, solidifying its IDM 2.0 strategy and U.S. manufacturing leadership. | Late 2026 - 2027 | 2026-10-01 | 2027-12-31 | This demonstrates Intel's progress in attracting external foundry customers for its advanced nodes and converting its significant advanced packaging investments into profitable revenue, crucial for the U.S. to establish a robust, end-to-end domestic semiconductor ecosystem. | Theme | theme_composer | INTC, AMAT, TSM, 005930.KO | 4 | 0.0097 | 1.18 | 0.85 | Economic | 1.25 | 1.2127 | 2026-07-15 | False | 1 | 0.6783 | 85.0465 | Theme composer | |||
| Samsung's Taylor Fab 1 in Texas is expected to become fully operational by the end of 2026, with progress towards 2nm mass production in early 2027, marking a significant step for leading-edge logic manufacturing in the U.S. | Q4 2026 - Q1 2027 | 2026-10-01 | 2027-03-31 | This represents a major advancement in U.S. leading-edge logic capacity, directly contributing to the theme's goal of domestic chip manufacturing and reducing reliance on overseas production for advanced nodes. | Ticker | theme_composer | 005930.KO, TSM, INTC, AMAT | 4 | 0.0078 | 1.18 | 0.92 | 1.0 | 0.843 | 2026-07-15 | False | 1 | 0.6647 | 72.1613 | Theme composer | ||||
| Completion of Process Design Kit (PDK) 0.9 for Intel 14A. | October | 2026-10-01 | 2026-10-31 | This is a crucial technical milestone that validates the development progress of the 14A process, enabling external customer engagements and design commitments, which is bullish for Intel Foundry's future revenue. | Ticker | INTC (ticker) | INTC_1e3a23d2 | 2026-07-23 | earnings_transcript | ||||||||||||||
| Construction of a new assembly and test building on the Songdo campus in Korea remains on schedule for completion by the end of 2026. | by the end of the year | 2026-10-01 | 2026-12-31 | This expansion provides critical cleanroom capacity to support growing data center and advanced packaging opportunities. | Ticker | AMKR (ticker) | AMKR_635c9091 | 2026-07-27 | earnings_transcript | ||||||||||||||
| Completion of the new test building in Korea, providing incremental space to support data center demand. | at the end of this year | 2026-10-01 | 2026-12-31 | This expansion is critical to support the growing demand for data center applications and advanced packaging, alleviating potential capacity constraints going into 2027. | Ticker | AMKR (ticker) | AMKR_4767d0b6 | 2026-04-27 | earnings_transcript | ||||||||||||||
| Completion of the Lehi 2 manufacturing shell, providing additional clean room space for the Embedded Processing segment. | at the end of this year | 2026-10-01 | 2026-12-31 | This expansion is crucial for supporting anticipated growth in the embedded side and ensures TI has the capacity to meet future demand seamlessly. | Ticker | TXN (ticker) | TXN_e7a2856f | 2026-07-22 | earnings_transcript | ||||||||||||||
| Applied Materials will host the unveiling of its new EPIC Center in Silicon Valley and an investor breakfast presentation at SemiCon West. | Monday afternoon, October 12th; Tuesday morning, October 13th | 2026-10-12 | 2026-10-13 | This event is expected to provide a longer-term outlook and more detailed color on AMAT's growth rates and strategic initiatives, potentially impacting investor sentiment and future guidance. | Ticker | AMAT (ticker) | AMAT_3a3fa0f1 | 2026-08-13 | earnings_transcript | ||||||||||||||
| Extension of the EUR 200 million revolving credit facility by one year. | maturity is scheduled for November this year | 2026-11-01 | 2026-11-30 | This provides X-FAB with additional room for maneuver regarding its financial indebtedness and liquidity, delaying the need for new financing options. | Ticker | XFAB.PA (ticker) | XFAB.PA_f7939667 | 2026-07-30 | earnings_transcript | ||||||||||||||
| Entegris Investor Day to share AI materials platform strategy, technology roadmap, and long-term financial framework. | November 9 in New York City | 2026-11-09 | 2026-11-09 | This event provides a detailed outlook on the company's strategic direction, technology advancements, and financial targets, which can significantly influence investor perception and valuation. | Ticker | ENTG (ticker) | ENTG_e9da66e6 | 2026-08-04 | earnings_transcript | ||||||||||||||
| Announcement of the new rate and pace of Micron's capital return program, primarily share repurchases. | from December 9th, which is the second anniversary of our CHIPS agreement signature | 2026-12-09 | 2026-12-31 | A higher-than-expected increase in share repurchases would be bullish for investor sentiment and valuation, signaling management's confidence and commitment to shareholder returns. A lower-than-expected increase could be bearish. | Ticker | MU (ticker) | MU_7f312c23 | 2026-06-24 | earnings_transcript | ||||||||||||||
| Meaningful contribution to HBM supply from Micron's Singapore HBM advanced package facility. | calendar 2027 | 2027-01-01 | 2027-12-31 | The successful ramp and meaningful contribution of this facility are crucial for scaling HBM supply and realizing operational synergies. Delays would impact HBM capacity and potentially market share. | Ticker | MU (ticker) | MU_b8c38d5c | 2025-12-17 | earnings_transcript | ||||||||||||||
| Volume ramp of HBM4E, Micron's next-generation High Bandwidth Memory product. | calendar 2027 | 2027-01-01 | 2027-12-31 | A successful HBM4E ramp is essential for Micron to maintain its leadership in the HBM market, capture future AI accelerator demand, and drive high-margin revenue growth, solidifying its position as a key AI enabler. | Ticker | MU (ticker) | MU_ddbf85f0 | 2026-03-18 | earnings_transcript | ||||||||||||||
| Continued tight supply-demand conditions for both DRAM and NAND across the industry. | beyond calendar 2026 | 2027-01-01 | 2027-12-31 | Persistent industry supply constraints are a key driver for strong memory pricing and high gross margins, benefiting Micron's profitability, but could also limit overall bit shipment growth. | Theme | MU (ticker) | MU_de754c9c | 2026-03-18 | earnings_transcript | ||||||||||||||
| Micron's Singapore advanced packaging facility for HBM contributing meaningfully to HBM supply. | calendar year 2027 | 2027-01-01 | 2027-12-31 | Increased HBM packaging capacity is a critical enabler for scaling HBM production to meet robust AI-driven demand, directly influencing Micron's HBM revenue and profitability. | Ticker | MU (ticker) | MU_233065c2 | 2026-03-18 | earnings_transcript | ||||||||||||||
| Micron's HBM4E product begins volume ramp. | volume expected to ramp in calendar 2027 | 2027-01-01 | 2027-12-31 | Successful and timely volume ramp of HBM4E is critical for Micron to maintain its technology leadership and capture high-value AI-driven demand, impacting revenue, market share, and margins. Delays or yield issues would be bearish. | Ticker | MU (ticker) | MU_b3fcf238 | 2026-06-24 | earnings_transcript | ||||||||||||||
| Launch of Intel's Coral Rapid CPUs, featuring multithreading capabilities. | Coral Rapid is coming up strong | 2027-01-01 | 2028-12-31 | This product is critical for Intel's competitive positioning against AMD in the server CPU market, potentially leading to market share gains and improved Data Center and AI (DCAI) performance. | Ticker | INTC (ticker) | INTC_5990c1d5 | 2026-04-23 | earnings_transcript | ||||||||||||||
| Intel's commitment to retire $3.8 billion in debt maturities coming due in 2027. | 2027 | 2027-01-01 | 2027-12-31 | Successful debt retirement strengthens the balance sheet and reduces future interest expense, signaling financial discipline; failure to do so would be bearish for credit ratings and investor confidence. | Ticker | INTC (ticker) | INTC_d1ea1eec | 2026-04-23 | earnings_transcript | ||||||||||||||
| Operating income margin dilution of approximately 1% to 2% due to depreciation and start-up costs for the Arizona facility, recognized in OpEx. | beginning in 2027 | 2027-01-01 | 2027-12-31 | This will temporarily impact profitability and operating income margins in 2027 before the facility scales and contributes meaningful revenue and higher margins in later years. | Ticker | AMKR (ticker) | AMKR_f52a5d0d | 2026-04-27 | earnings_transcript | ||||||||||||||
| Completion of Phase 1 construction of the Arizona advanced packaging campus. | planned to be completed in 2027 | 2027-01-01 | 2027-12-31 | This milestone is essential for bringing the new U.S. manufacturing capacity online, which is a key part of Amkor's long-term strategic expansion and geographic diversification. Delays would impact future revenue ramps. | Ticker | AMKR (ticker) | AMKR_2314b210 | 2026-04-27 | earnings_transcript | ||||||||||||||
| Amkor to receive government incentives, including investment tax credits and grants, for its Arizona advanced packaging facility. | come in on a lag | 2027-01-01 | 2027-12-31 | These incentives are a significant funding source (upwards of $2.85 billion) for the multi-billion dollar Arizona project, mitigating financial risk and improving return on investment. | Ticker | AMKR (ticker) | AMKR_a6d1ab7a | 2026-02-09 | earnings_transcript | ||||||||||||||
| Volume production of the new 3-nanometer fab in Tainan Science Park, Taiwan. | first half of 2027 | 2027-01-01 | 2027-06-30 | This is a bullish factor, as it will increase N3 capacity to meet strong AI demand and support future revenue growth. | Ticker | TSM (ticker) | TSM_3e406e44 | 2026-04-16 | earnings_transcript | ||||||||||||||
| Volume production commencement for the new 3-nanometer fab in Tainan Science Park. | first half of 2027 | 2027-01-01 | 2027-06-30 | This milestone will increase 3nm capacity, addressing strong AI-driven demand and potentially boosting revenue for TSMC. | Ticker | TSM (ticker) | TSM_9b9acdbe | 2026-04-15 | earnings_transcript | ||||||||||||||
| TSMC securing manufacturing business for a customer's next-generation LPU (Logic Processing Unit) product. | next-generation LPU | 2027-01-01 | 2029-12-31 | Bullish for market share and revenue if successful, demonstrating continued technology leadership and customer trust in a competitive segment. | Ticker | TSM (ticker) | TSM_3a42201a | 2026-04-16 | earnings_transcript | ||||||||||||||
| Completion of Texas Instruments' acquisition of Silicon Labs, subject to necessary regulatory approvals. | first half of 2027 | 2027-01-01 | 2027-06-30 | This strategic transaction is expected to enhance TI's global leadership in embedded wireless connectivity, expand its product portfolio, and leverage its manufacturing capabilities, potentially impacting future revenue growth and competitive positioning. | Ticker | TXN (ticker) | TXN_73eea687 | 2026-04-22 | earnings_transcript | ||||||||||||||
| Completion of the acquisition of Silicon Labs, subject to necessary regulatory approvals. | first half of 2027 | 2027-01-01 | 2027-06-30 | This transaction enhances TI's global leadership in embedded wireless connectivity, expands its portfolio, and leverages TI's manufacturing and market channels. Successful closure is bullish for TI's long-term strategic positioning. | Ticker | TXN (ticker) | TXN_be188a7c | 2026-04-22 | earnings_transcript | ||||||||||||||
| First wafer output from Micron's first Idaho fab, accelerated to mid-calendar 2027. | mid-calendar 2027 | 2027-05-01 | 2027-06-30 | Achieving this accelerated milestone demonstrates strong execution and is crucial for adding long-term supply capacity to meet persistent demand. Delays would signal execution challenges and impact future supply. | Ticker | MU (ticker) | MU_df787b41 | 2025-12-17 | earnings_transcript | ||||||||||||||
| Initial wafer output from Micron's first manufacturing fab in Idaho. | mid-calendar 2027 | 2027-05-01 | 2027-06-30 | This milestone signifies the activation of new domestic production capacity, crucial for long-term supply expansion and potentially benefiting from government incentives like the CHIPS Act. | Ticker | MU (ticker) | MU_6fcf0e64 | 2026-03-18 | earnings_transcript | ||||||||||||||
| Micron begins initial wafer output from its first Idaho fab. | mid-calendar 2027 | 2027-05-01 | 2027-06-30 | Successful and timely initial wafer output is crucial for increasing DRAM supply and meeting future demand. Delays or lower-than-expected yields could exacerbate supply constraints and negatively impact cost per bit and revenue. | Ticker | MU (ticker) | MU_f544d350 | 2026-06-24 | earnings_transcript | ||||||||||||||
| CoWoS pilot line reaching maturity for production. | about another one year to be mature so we can put it into the production with our customer. | 2027-07-01 | 2027-07-31 | This milestone would enable TSMC to address the tight advanced packaging capacity, supporting customer growth in AI and HPC, and potentially alleviating a key bottleneck for future revenue. | Ticker | TSM (ticker) | TSM_91640f5f | 2026-07-16 | earnings_transcript | ||||||||||||||
| The Tongluo manufacturing site (acquired from Powerchip Semiconductor) beginning to support meaningful product shipments. | beginning in fiscal 2028 | 2027-09-01 | 2028-08-31 | This new fab capacity is crucial for addressing long-term memory demand and increasing Micron's overall supply, which will directly impact future revenue growth and market share. | Ticker | MU (ticker) | MU_a7963dc2 | 2026-03-18 | earnings_transcript | ||||||||||||||
| Initial wafer output from the new NAND fab at Micron's Singapore site. | second half of calendar 2028 | 2028-07-01 | 2028-12-31 | This new NAND capacity is vital for meeting the accelerating demand for data center SSDs and other NAND products, directly impacting future revenue and market share in a tight supply environment. | Ticker | MU (ticker) | MU_030fd276 | 2026-03-18 | earnings_transcript |
Constituents
- — Coherent, Inc.
- — Micron Technology, Inc.
- — SK hynix Inc.
- — Samsung Electronics Co., Ltd.
- GLWT2— Corning Inc
- INTCT2— Intel Corp.
- AMATT3— Applied Materials, Inc.
- AMKRT3— Amkor Technology, Inc.
- ENTGT3— Entegris, Inc.
- GFST3— GLOBALFOUNDRIES Inc.
- SKYTT3— SkyWater Technology, Inc.
- TSMT3— Taiwan Semiconductor Manufacturing Company Limited
- TXNT3— Texas Instruments Incorporated
- WOLFT3— Wolfspeed Inc.
- XFAB.PAT3— X-FAB Silicon Foundries SE
- 6488.TWOT3· no notes yet