Home / Themes / Chips '24: IC and Components
Chips '24: IC and Components (view performance)
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Theme thesis · 5/5 sections · Tickers 14 with notes · 6 pending
Bull / Bear Details has the investment thesis and bull/bear points. Overview is monitoring guidance (hiring, forums, second-order trends, search keywords, Google Trends, datasets).
Bull / Bear DetailsThe AI '24: IC and Components theme remains strongly bullish, driven by unprecedented global demand for AI applications and massive hyperscaler investments in d
Thesis
The AI '24: IC and Components theme remains strongly bullish, driven by unprecedented global demand for AI applications and massive hyperscaler investments in data center infrastructure. Continuous advancements in semiconductor technology and robust government incentives further fuel growth, though persistent supply chain constraints, intense competition, and macroeconomic uncertainties pose notable risks.
Bull case
Increased global demand for AI applications is driving unprecedented capital expenditure in data center infrastructure, with leading hyperscalers committing hundreds of billions in 2026, nearly doubling 2025 levels. AI-specific data center usage is projected to account for trillions in investment over the next five years, fueling significant growth in the ICs and components sector.
Advancements in semiconductor technology are continuously enhancing performance and enabling higher adoption rates across industries. This includes rapid innovation in next-generation optical interconnects (800G/1.6T/3.2T), advanced packaging, custom AI accelerators, and specialized memory solutions like HBM, all critical for scaling AI workloads and driving demand for advanced components.
Government incentives and policies favoring domestic chip production are significantly benefiting companies in this space. Initiatives like the US CHIPS Act, with enhanced tax credits (35% for investments after 2025) and billions in grants, and the EU's Chips Act 2.0, are actively promoting local manufacturing, R&D, and supply chain resilience, providing substantial financial support and strategic direction.
Bear case
Persistent and evolving supply chain disruptions remain a significant risk. The immense demand for AI chips, particularly HBM, is causing acute memory shortages that impact other sectors like smartphones and PCs, leading to price hikes. Furthermore, geopolitical factors are exacerbating raw material shortages (e.g., rare earths, tungsten) and creating uncertainty in critical component availability, with lead times for substrate and assembly capacity remaining very tight.
Intense competition from emerging markets and established players could pressure margins and market share. The market for AI ICs and components is highly competitive, with reliance on a few large hyperscaler customers introducing concentration risk. The potential for customers to diversify suppliers or develop in-house solutions, alongside aggressive competition from larger rivals, poses a continuous threat.
Macroeconomic uncertainties, including geopolitical tensions and potential shifts in global trade policies, could impact capital expenditures in tech infrastructure. While AI demand is currently robust, there are long-term questions regarding whether AI revenues can fully justify the unprecedented scale of infrastructure investment, introducing a risk of potential oversupply or a future deceleration in demand beyond current visibility.
Overview
Hiring Trend Watchpoints
High-performing operators are aggressively hiring for specialized AI-centric roles, reflecting the theme's strong growth drivers and evolving technological landscape. Key hiring trends include a strong focus on 'AI-Augmented Engineering' (integrating AI into design, simulation, verification, and analysis workflows, as seen with Synopsys's AgentEngineer and Multiphysics Fusion technologies). There is also significant demand for specialists in 'Advanced Packaging & Optical Interconnects' (engineers for 2.5D/3D integration, chiplets, 800G/1.6T/3.2T optical modules, silicon photonics, coherent optics, and high-layer count PCBs like TTM's 100+ layers). 'Custom AI Accelerator Design' (XPU architects, ASIC designers, particularly for hyperscaler engagements like Broadcom's) and 'High-Density Power Management' (power electronics engineers for 48V/800V zonal architectures, integrated voltage regulators, and PMICs to address AI workload power efficiency, as seen with ADI and MPWR) are also critical. Finally, 'Edge AI/Physical AI' expertise (FPGA specialists for robotics, sensor fusion, and AI-native devices, as highlighted by Lattice and Qualcomm) is in high demand. Confirmation of execution would be a sustained increase in job postings for these specialized roles, particularly in R&D and advanced manufacturing, and successful talent acquisition in competitive markets. A warning of deterioration would be a shift towards generalist engineering roles, hiring freezes in AI-specific departments, or significant delays in capacity expansion projects due to a lack of skilled labor.
Forum Watchlist
- Reddit — r/hardwareHigh
Discussions on new AI hardware releases, performance benchmarks, user sentiment, and emerging AI PC trends.
- Reddit — r/semiconductorsHigh
Industry news, technology advancements, supply chain discussions, and company-specific insights, especially regarding HBM and advanced packaging.
- Forum — AnandTech ForumsMedium
In-depth technical discussions on AI accelerators, data center infrastructure, advanced packaging, and power delivery solutions.
- Forum — ServeTheHome ForumsMedium
Discussions on enterprise hardware, hyperscaler data center build-outs, optical networking, and power systems for AI workloads.
- Community — LoRa Alliance CommunityLow
Updates on LoRaWAN deployments, LoRa Plus applications, and IoT ecosystem growth, relevant for Semtech's diversification.
- Reddit — r/roboticsLow
Discussions on humanoid robots, robotaxis, and physical AI applications, relevant for Lattice and Qualcomm's edge AI initiatives.
Second Order Trends
Several second-order trends are emerging, indicating the evolving landscape of AI '24: IC and Components: * **AI-Native System Design & Automation**: The shift from component-level AI to holistic 'silicon-to-systems' design, where AI itself is used to accelerate and optimize the design of complex AI systems (e.g., Synopsys's Multiphysics Fusion and AgentEngineer AI). This includes hardware-software co-design and system-level simulation, driving demand for integrated EDA solutions. * **Specialized AI Networking**: Beyond general data center networking, there's an emerging focus on ultra-high-bandwidth, low-latency AI-specific networking solutions (e.g., Broadcom's Tomahawk 6, Semtech's 1.6T/3.2T optical interconnects) to prevent bottlenecks in massive AI clusters and enable seamless data flow. * **Power Delivery as a Strategic Differentiator**: As AI power consumption soars, efficient and high-density power management (e.g., 48V/800V zonal architectures, integrated voltage regulators, PMICs) is becoming a critical competitive battleground and a driver for M&A (e.g., ADI's Empower acquisition, MPWR's 800V solutions). * **Physical AI and Robotics**: The expansion of AI from cloud/edge inference to real-world physical applications like humanoid robots, autonomous vehicles (robotaxis), and advanced industrial automation, driving demand for specialized, deterministic, low-power AI components (e.g., Lattice's FPGAs for motor control, Qualcomm's Dragon Wing platform). * **Advanced Substrate & Module Integration**: The increasing complexity of AI chips is pushing innovation beyond the silicon die to the PCB and module level, with ultra-high-layer count PCBs (e.g., TTM's 100+ layers) and integrated modules becoming essential for performance and density, creating higher barriers to entry.
Search Keywords Brand Product
- AI accelerator
- Custom XPU
- SerDes
- HBM4
- DDR5 RCD
- PMIC
- LoRa Plus
- Edge AI
- Silicon Photonics
- Coherent Optics
- 1.6T Transceiver
- 200G per lane optical
- GaN4 RF
- 48V Zonal Architecture
- 800V Power Module
- Advanced Packaging
- 100+ Layer PCB
- EDA Software
- Hardware-Assisted Verification
- Ansys Integration
- Snapdragon Digital Chassis
- AgentEngineer AI
- Multiphysics Fusion
- Empower Semiconductor IVR
- HieFo indium phosphide
- Dragon Wing robotics
- RISC-V data center inference
- DDR5 Gen 3
- PCIe 7.0
- MRDIMM
- Snapdragon X2 Plus
- VMware Cloud Foundation
Search Keywords Policy Regulatory
- CHIPS Act
- EU Chips Act
- Japan Semiconductor Strategy
- US China Export Controls semiconductor
- Domestic chip production incentives
Search Keywords Event Phrases
- AI Infrastructure Spending
- Data Center CapEx 2026
- Semiconductor supply chain disruptions
- Memory market outlook 2026
- AI PC market share
- Humanoid robot development
- Optical interconnect capacity
Google Trend Product Category Intent
• AI chip performance
• Data center power efficiency
• Optical interconnect speed
• Edge AI device applications
• AI PC features
• Advanced semiconductor packaging
• AI server cooling solutions
• Custom AI chip design
• High bandwidth memory demand
• RISC-V AI inference
Google Trend Consumer Intent
• What is AI hardware
• How AI works in devices
• Smart home AI chips
• AI in electric vehicles
• AI robotics components
• AI robot capabilities
• AI in autonomous vehicles
• Next-gen smartphone AI
Google Trend Macro Policy Terms
• Chip manufacturing jobs
• Semiconductor industry growth
• AI technology impact
• Global chip shortage update
• Semiconductor supply chain resilience
• AI infrastructure investment
Top datasets to track
1. World Semiconductor Trade Statistics (WSTS) Global Sales Type: Economic Data · Provider: World Semiconductor Trade Statistics (WSTS) Cadence: Monthly Why it matters: Signals overall industry demand and growth potential for integrated circuits and components, directly reflecting the health of the AI '24 theme and its underlying market strength. Suggested query: WSTS global semiconductor sales report Confidence: 0.9
2. Aggregate Hyperscaler CapEx Forecasts (MSFT, AMZN, GOOG, META, AAPL) Type: Company-level Data · Provider: Company Earnings Reports (Microsoft, Alphabet, Amazon, Meta, Apple) Cadence: Quarterly Why it matters: Directly correlates with demand for AI infrastructure, data center build-outs, and custom AI accelerators, which are primary drivers for many theme constituents. Monitoring these forecasts provides forward-looking insight into demand. Suggested query: Hyperscaler capital expenditure forecasts Confidence: 0.9
3. TrendForce (DRAMeXchange) LPDDR5X Spot Price and Supply Allocation Type: Alt Data · Provider: TrendForce (DRAMeXchange) Cadence: Weekly/Monthly Why it matters: Crucial for monitoring supply constraints impacting handset production (e.g., Qualcomm) and the broader memory market, especially due to HBM demand redirection for AI data centers. Price and allocation shifts signal easing or worsening shortages. Suggested query: TrendForce LPDDR5X spot price and supply Confidence: 0.9
4. Synergy Research Group - Data Center Investment Levels Type: Industry Data · Provider: Synergy Research Group Cadence: Quarterly Why it matters: Provides a comprehensive view of infrastructure expansion supporting AI growth, including spending on hardware, software, and services. AI workloads are projected to make up a significant portion of data center expansion. Suggested query: Synergy Research Group data center investment Confidence: 0.9
5. Supplyframe Component Lead Time Index (Semiconductors) Type: Alt Data · Provider: Supplyframe Cadence: Monthly Why it matters: Indicates potential supply chain disruptions or easing, affecting production and delivery timelines for ICs and components, a key bear risk for the theme. Extended lead times can signal capacity constraints and impact revenue. Suggested query: Supplyframe semiconductor lead time index Confidence: 0.9
Key Metrics
| Metric | Cadence | What It Signals | Update Source |
|---|---|---|---|
| Global semiconductor sales | Monthly | Industry demand and growth potential | Google_Sheets |
| Government subsidy announcements | Ad hoc | Policy support for domestic manufacturing | Google_Sheets |
| Data center investment levels | Quarterly | Infrastructure expansion supporting AI growth | Google_Sheets |
Upcoming Catalysts
| Catalyst | Estimated Timing | Estimated Date Start | Estimated Date End | Why It Matters | Ticker Or Theme Specific | Source Types | Contributing Tickers | Mention Count | Base Score | Source Weight | Specificity Weight | Macro Bridge | Macro Bridge Multiplier | Theme Score | Date Aggregated | Manual Override | Bridge Mention Count | Theme Base Score | Theme Importance Score | Catalyst Source | Catalyst ID | Transcript Date | Source Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Acceleration in volume production of next-generation AI accelerators by hyperscalers and leading semiconductor customers. | Second half of 2026, with ongoing announcements and production ramps. | 2026-07-01 | 2026-12-31 | This directly drives demand for core Electronic Design Automation (EDA), hardware-assisted verification, high-speed interconnect IP, and various components, underpinning the 'AI-driven demand strength' narrative and overall revenue growth for the theme. It impacts companies like Synopsys (EDA), Broadcom (custom accelerators, networking), Semtech (optical modules), MACOM (optical components), and TTM Technologies (advanced PCBs). | Theme | theme_composer | SNPS, AVGO, SMTC, MTSI, TTMI, ADI, MPWR, LSCC, RMBS, QCOM, 6723.T | 11 | 0.0801 | 1.18 | 0.92 | Regulatory/Policy | 1.35 | 11.7414 | 2026-06-20 | False | 2 | 2.6142 | 383.1297 | Theme composer | |||
| Continued robust capital expenditure (CapEx) by hyperscale cloud providers for AI infrastructure buildout, driving demand for advanced ICs and components. | Ongoing through 2026, with key updates during quarterly earnings calls of major hyperscalers. | 2026-06-20 | 2026-09-30 | This catalyst is a primary demand driver for the entire AI IC and Components theme, directly impacting revenue and growth for numerous constituent tickers involved in supplying chips, modules, and related infrastructure for AI data centers. Hyperscalers are projected to spend hundreds of billions in 2026, fueling significant growth. | Theme | theme_composer | LSCC, AVGO, ADI, MPWR, SMTC, MTSI, TTMI, SNPS, RMBS, QCOM, 6723.T, MELE.BR | 12 | 0.0695 | 1.18 | 0.92 | 1.0 | 7.5481 | 2026-06-20 | False | 1 | 2.8151 | 305.6034 | Theme composer | ||||
| Resolution or easing of the global DRAM supply shortage, particularly for non-HBM applications. | Persisting through the second half of 2026, with potential easing towards year-end or early 2027. | 2026-07-01 | 2027-01-31 | The ongoing DRAM shortage, driven by High Bandwidth Memory (HBM) demand for AI, has led to significant price surges and extended lead times, impacting the production and sales of devices like smartphones and general-purpose servers. An easing of this shortage would alleviate cost pressures and enable higher shipment volumes for affected companies like Qualcomm, Renesas, and Rambus. | Theme | theme_composer | QCOM, 6723.T, RMBS | 3 | 0.009 | 1.18 | 0.92 | Regulatory/Policy | 1.35 | 1.3129 | 2026-06-20 | False | 2 | 0.4687 | 68.6879 | Theme composer | |||
| Ongoing government policy actions and subsidy announcements, such as those under the US CHIPS and Science Act, aimed at boosting domestic semiconductor manufacturing and research. | Ad hoc announcements and policy updates are ongoing, with a significant construction deadline for tax credits by December 31, 2026. | 2026-06-20 | 2026-12-31 | Government incentives and policies favoring domestic chip production are a significant bull factor for the sector, providing substantial funding and tax credits to reduce capital costs and encourage investment in manufacturing facilities. This directly benefits companies with US manufacturing or R&D presence, such as Analog Devices and TTM Technologies. | Theme | theme_composer | ADI, TTMI, 6723.T | 3 | 0.0084 | 1.18 | 0.92 | Regulatory/Policy | 1.35 | 1.2289 | 2026-06-20 | False | 1 | 0.4643 | 68.0442 | Theme composer | |||
| Broadcom's continued expansion of its custom AI accelerator (XPU) customer base and the achievement of significant gigawatt deployment targets. | Ongoing, with key deployment targets and revenue milestones expected through 2027. Broadcom's Q3 FY2026 earnings call on September 2, 2026, will provide an update. | 2026-06-20 | 2027-12-31 | Broadcom is a dominant player in custom AI accelerators, with strategic long-term agreements with major hyperscalers. Its success validates the custom AI silicon market and drives demand for related components and services, impacting the broader theme. | Ticker | theme_composer | AVGO | 1 | 0.0322 | 1.18 | 0.85 | 1.0 | 3.231 | 2026-06-20 | False | 1 | 0.3643 | 36.5415 | Theme composer | ||||
| Ramp up of high-volume shipments of TPU version 8i to Google, accelerated shipments of Ironwood to Anthropic, continued shipments of Jalapeno for OpenAI, and production shipments of Meta's custom MTIA accelerator. | Q4 2026 | 2026-09-01 | 2026-11-30 | These deployments are expected to drive Q4 AI revenue to $21.7 billion, up 236% year-on-year, demonstrating strong execution and demand in their key AI semiconductor business. | Ticker | AVGO (ticker) | AVGO_d6960b6c | 2026-09-02 | earnings_transcript | ||||||||||||||
| Successful launch and initial deployment of the first $35 billion trench of the AI XPU platform with Apollo and Blackstone. | currently being launched | 2026-06-03 | 2026-09-30 | This strategic initiative aims to provide significant compute capacity to leading AI frontier labs, potentially expanding Broadcom's market reach and revenue opportunities beyond direct chip sales. | Ticker | AVGO (ticker) | AVGO_632c1276 | 2026-06-03 | earnings_transcript | ||||||||||||||
| Broadcom's actual AI semiconductor revenue for Q3 fiscal year 2026 compared to its guidance of $16 billion. | in Q3 | 2026-07-01 | 2026-09-30 | As the primary growth driver, performance against this guidance will be a critical indicator of the strength of the AI supercycle and Broadcom's competitive position, directly influencing investor sentiment. | Ticker | AVGO (ticker) | AVGO_a1ccd4f6 | 2026-06-03 | earnings_transcript | ||||||||||||||
| Broadcom's actual consolidated revenue for Q3 fiscal year 2026 compared to its guidance of $29.4 billion. | For Q3 2026 | 2026-07-01 | 2026-09-30 | Achieving or exceeding this guidance would reinforce investor confidence in Broadcom's growth trajectory, particularly in the rapidly expanding AI semiconductor market, impacting investor confidence and valuation. | Ticker | AVGO (ticker) | AVGO_9073cdaf | 2026-06-03 | earnings_transcript | ||||||||||||||
| Confirmation (or emergence) of constraints and committed supply from foundries (leading-edge 3nm/2nm capacity), HBM vendors and advanced packaging partners necessary to meet Broadcom's AI backlog. | over the next eighteen months (as backlog ships) | 2025-12-11 | 2027-06-11 | Secured wafer, HBM and advanced-packaging supply is required to meet Broadcom's AI delivery schedule; supply shortfalls would delay shipments, elevate costs and compress margins (bearish), while robust confirmations would support revenue delivery and margin plans (bullish). | Ticker | AVGO (ticker) | AVGO_9b05718d | 2025-12-11 | earnings_transcript | ||||||||||||||
| Conversion/realization of Broadcom's disclosed $73 billion AI-related order backlog (switches, XPUs, DSPs, optical components) which management expects to ship over the next 18 months. | to be delivered over the next eighteen months | 2025-12-11 | 2027-06-11 | The pace and completeness of backlog conversion will materially drive Broadcom's AI revenue growth, margin mix (systems/pass-through dilution), and supply requirements; faster conversion is bullish for revenue and valuation, while slower conversion or cancellations are bearish. | Ticker | AVGO (ticker) | AVGO_8104552d | 2025-12-11 | earnings_transcript | ||||||||||||||
| Broadcom has fully secured capacity for leading-edge wafers, high-bandwidth memory and substrates for 2026–2028. | for 2026 through 2028 | 2026-01-01 | 2028-12-31 | Mitigates supply constraints risk and provides visibility into delivery timelines and backlog, supporting investor confidence in growth trajectory. | Ticker | AVGO (ticker) | AVGO_c6986cdd | 2026-03-04 | earnings_transcript | ||||||||||||||
| Western Digital is on track to start volume production of its 40-terabyte ePMR drives. | second half of calendar year 2026 | 2026-07-01 | 2026-12-31 | This product ramp is expected to drive higher capacity shipments, improve gross margins through a better product mix and total cost of ownership (TCO) value, and support increased pricing, materially impacting revenue and profitability. | Ticker | WDC (ticker) | WDC_f943a3b4 | 2026-04-30 | earnings_transcript | ||||||||||||||
| Western Digital intends to monetize its remaining 1.7 million SanDisk shares through a tax-free equity for equity transaction. | before the end of calendar year '26 | 2026-07-01 | 2026-12-31 | This strategic action will further strengthen the company's balance sheet, potentially impacting cash flow, capital allocation, and investor sentiment. | Ticker | WDC (ticker) | WDC_a735b1e5 | 2026-04-30 | earnings_transcript | ||||||||||||||
| Western Digital plans to have all major customers qualified on UltraSMR technology, with close to 60% of exabytes shipped on UltraSMR by the end of fiscal year '27. | by the end of calendar year 2027 | 2026-07-01 | 2027-12-31 | Increased UltraSMR adoption drives cost efficiency and higher capacity shipments, expanding customer reach and positively impacting gross margins and market share. | Ticker | WDC (ticker) | WDC_1507511e | 2026-04-30 | earnings_transcript | ||||||||||||||
| Increased wafer supply from partners, contributing to the resolution of supply bottlenecks and higher product shipments for Renesas. | wafer supply to increase from Q3 | 2026-07-01 | 2026-09-30 | Increased wafer supply is critical for Renesas to meet strong demand, especially in AI/data center and digital power, and to potentially exceed guidance, supporting revenue growth and market share. | Ticker | 6723.T (ticker) | 6723.T_9a0011bf | 2026-04-23 | earnings_transcript | ||||||||||||||
| The actual impact of the anticipated DRAM shortage on Renesas' Industrial/Infrastructure/IoT (IIoT) business performance. | towards the second half | 2026-07-01 | 2026-12-31 | A severe DRAM shortage could constrain IIoT product shipments, potentially leading to lower-than-expected revenue and impacting margins, especially if it leads to a shift towards higher-end models or an inability to meet demand. | Ticker | 6723.T (ticker) | 6723.T_d0262d91 | 2026-02-04 | earnings_transcript | ||||||||||||||
| Completion of the timing business transfer, including regulatory approvals, and the subsequent decision on the allocation of the $3 billion in proceeds (growth investments vs. debt repayment and shareholder returns). | by the end of this year at the latest | 2026-04-01 | 2026-12-31 | Successful completion and strategic allocation of proceeds could boost investor confidence and potentially fund future growth initiatives or enhance shareholder value. Delays or unfavorable allocation could negatively impact sentiment. | Ticker | 6723.T (ticker) | 6723.T_f6e52836 | 2026-02-04 | earnings_transcript | ||||||||||||||
| The actual trajectory of automotive demand in the second half of 2026, influenced by macro uncertainties (e.g., crude oil prices, consumer spending) and new platform launches. | second half of the year | 2026-07-01 | 2026-12-31 | While Renesas has a relatively optimistic view and plans to build channel inventory, the overall macro uncertainty for automotive demand could impact revenue, guidance, and investor sentiment for this key segment. | Theme | 6723.T (ticker) | 6723.T_36768e25 | 2026-04-23 | earnings_transcript | ||||||||||||||
| Renesas potentially adjusting product prices upwards in response to rising raw material, transportation, and manufacturing costs, as well as competitor price increases. | at some point in time | 2026-07-01 | 2026-12-31 | Price adjustments could help maintain or improve gross margins in an inflationary environment. Failure to adjust prices could lead to margin erosion, while aggressive increases could impact customer relationships or market share. | Ticker | 6723.T (ticker) | 6723.T_bdbdd1a8 | 2026-04-23 | earnings_transcript | ||||||||||||||
| Regulatory approval and closing of the Empower Semiconductor acquisition. | a little later following regulatory approval | 2026-07-01 | 2026-10-31 | The acquisition is expected to expand ADI's total addressable market within the hypergrowth AI accelerator space and solidify its position, driving significant revenue growth starting in fiscal 2027. | Ticker | ADI (ticker) | ADI_607f9973 | 2026-05-20 | earnings_transcript | ||||||||||||||
| Alignment of supply and demand in the assembly side of the supply chain. | by September | 2026-09-01 | 2026-09-30 | Resolution of assembly constraints is crucial for Lattice to support customer growth plans and mitigate increasing costs, ensuring continued revenue momentum. | Ticker | LSCC (ticker) | LSCC_9bb176f5 | 2026-08-04 | earnings_transcript | ||||||||||||||
| Launch of a new digital current sensor, produced from a local China wafer fab, following final qualification at the customer and Melexis. | second half of this year after summer | 2026-09-01 | 2026-12-31 | This event signifies a concrete execution of Melexis's China localization strategy, potentially enhancing market share with Chinese customers and improving supply chain resilience, which is a key bull point for the company. | Ticker | MELE.BR (ticker) | MELE.BR_454fc089 | 2026-07-29 | earnings_transcript | ||||||||||||||
| The automotive market is seeing a continued shift towards hybrid vehicle adoption, with Western OEMs restarting combustion engine R&D and new platforms. | medium term | 2026-02-04 | 2027-02-04 | This trend is seen as positive for Melexis, as hybrid vehicles offer content opportunities in both electric and combustion engines, potentially increasing content per vehicle and driving long-term growth. | Theme | MELE.BR (ticker) | MELE.BR_c041cf8b | 2026-02-04 | earnings_transcript | ||||||||||||||
| Melexis' customers are transitioning to new, more modern versions of Melexis' driver and ASIC products. | will happen in Q2, Q3 | 2026-04-01 | 2026-09-30 | This transition is expected to drive stronger orders in H2 2026 as customers reduce inventory of older versions and then order new ones, contributing to the anticipated sales growth. | Ticker | MELE.BR (ticker) | MELE.BR_40a3cd1d | 2026-02-04 | earnings_transcript | ||||||||||||||
| Melexis expects sales growth in the second half of 2026, following a similar dynamic to 2025. | second half of '26 | 2026-07-01 | 2026-12-31 | Achieving this growth would positively impact revenue and investor sentiment, confirming the recovery phase. Failure to achieve it could negatively impact guidance and valuation. | Ticker | MELE.BR (ticker) | MELE.BR_924910e1 | 2026-02-04 | earnings_transcript | ||||||||||||||
| Resumption of sequential gross margin improvements of 10-20 basis points quarter-over-quarter, driven by longer backlog and a favorable product mix shift towards higher-value modules. | at some time during the year (2026) with incremental sequential improvements of maybe 10 to 20 basis points quarter over quarter | 2026-04-01 | 2026-12-31 | Achieving this would signal favorable product mix and pricing power, supporting profitability; failure to improve would indicate continued margin pressure at the low end of their target range. | Ticker | MPWR (ticker) | MPWR_fce6944a | 2026-02-05 | earnings_transcript | ||||||||||||||
| Industry-wide adoption of vertical power solutions in data centers. | in 2026 | 2026-01-01 | 2026-12-31 | Increased adoption of vertical power solutions is a natural market evolution that will drive demand for MPWR's high-density power management products, benefiting its data center segment. | Theme | MPWR (ticker) | MPWR_40df1d75 | 2026-02-05 | earnings_transcript | ||||||||||||||
| Receipt of one of the largest orders in MACOM's European Semiconductor Center (MESC) history from a U.K. defense company for airborne defense systems. | over the next month or 2 | 2026-09-05 | 2026-11-05 | This significant order would demonstrate strong traction and market penetration in the European defense market, contributing directly to future revenue growth for the MESC facility. | Ticker | MTSI (ticker) | MTSI_464533a4 | 2026-08-06 | earnings_transcript | ||||||||||||||
| The fifth-generation Snapdragon Digital Chassis will be ramping. | ramping in September | 2026-09-01 | 2026-09-30 | This ramp-up signifies a significant increase in content per vehicle and is a key driver for Qualcomm's automotive revenue growth, supporting its goal to become the #1 automotive semiconductor player by revenue. | Ticker | QCOM (ticker) | QCOM_40d14d5c | 2026-07-29 | earnings_transcript | ||||||||||||||
| Qualcomm will provide updates on the Snapdragon Start program for smart glasses at Snapdragon Summit. | Snapdragon Summit in September | 2026-09-01 | 2026-09-30 | This event will offer insights into Qualcomm's strategy to expand the smart glasses ecosystem and accelerate the transition of this category to smart glasses, potentially opening a significant new market for personal AI form factors. | Ticker | QCOM (ticker) | QCOM_4e5feba4 | 2026-07-29 | earnings_transcript | ||||||||||||||
| Broader market penetration and adoption of ACCs by additional hyperscalers, driven by the successful deployment and demonstrated benefits by a lead customer. | As this hyperscaler demonstrates ACC's benefit versus the incumbent technologies, over the coming quarters | 2026-01-01 | 2026-12-31 | This could significantly expand the total addressable market for Semtech's ACC solutions, leading to substantial revenue growth and market leadership in data center interconnects. | Ticker | SMTC (ticker) | SMTC_8b3b66b0 | 2025-11-24 | earnings_transcript | ||||||||||||||
| Completion of the divestiture of noncore assets. | making solid progress on the divestiture of noncore assets... we really cannot predict [timing]. But rest assured, this is my top priority. | 2026-01-01 | 2026-09-30 | This will help address margin disparities, enable Semtech to focus fully on core business priorities, and could improve overall company margins and investor sentiment. | Ticker | SMTC (ticker) | SMTC_81b8ed4e | 2025-11-24 | earnings_transcript | ||||||||||||||
| Volume ramp of Active Copper Cables (ACCs) with a major hyperscaler for 200 gigabit per second cable programs. | during calendar year 2026 | 2026-01-01 | 2026-12-31 | ACCs are a net gain for Semtech, offering significant power savings (up to 90% lower than DSP-based AEC solutions) and encroaching into AEC and DAC markets, accelerating data center revenue growth. | Ticker | SMTC (ticker) | SMTC_2b4d6edf | 2025-11-24 | earnings_transcript | ||||||||||||||
| Securing additional design wins for Active Copper Cables (ACCs) with new customers beyond the lead hyperscaler. | over the coming quarters | 2026-01-01 | 2026-09-30 | Expanding ACC design wins will drive broader market penetration and contribute to accelerating data center revenue growth. | Ticker | SMTC (ticker) | SMTC_6ab2d7b1 | 2025-11-24 | earnings_transcript | ||||||||||||||
| Securing design wins for onboard CopperEdge linear equalizers for high-volume, high-speed PCB traces and connectors. | over the coming quarters | 2026-01-01 | 2026-09-30 | This represents a new application area and revenue stream for Semtech's signal integrity solutions, expanding their market reach in high-speed links. | Ticker | SMTC (ticker) | SMTC_43e7dfd1 | 2025-11-24 | earnings_transcript | ||||||||||||||
| New smart glasses and smartphone platform launches incorporating Semtech's sensing technology, including the newly acquired Force Sensing portfolio. | over the coming quarters | 2026-01-01 | 2026-09-30 | These new launches will drive revenue growth in the high-end consumer market and demonstrate market share gains for Semtech's differentiated sensing solutions. | Ticker | SMTC (ticker) | SMTC_069c7c0d | 2025-11-24 | earnings_transcript | ||||||||||||||
| Volume ramp of CopperEdge ICs for 1.6T Active Copper Cable (ACC) deployments with a lead hyperscaler. | start shipping CopperEdge for the 1.6T ACC hyperscaler deployment this quarter, with demand accelerating throughout the year | 2026-03-16 | 2027-01-31 | This represents a significant new revenue driver for the data center segment, crucial for achieving the company's aggressive data center growth targets and validating ACC technology adoption. Faster-than-expected acceleration would be bullish. | Ticker | SMTC (ticker) | SMTC_7b1afeb8 | 2026-03-16 | earnings_transcript | ||||||||||||||
| Significant volume ramp of FiberEdge ICs for 1.6T optical transceivers. | significant ramp in the second half of the year | 2026-08-01 | 2027-01-31 | This is a key driver for Semtech's data center revenue growth, particularly as hyperscalers transition to higher-speed platforms, and successful execution will reinforce its position in the AI interconnect market. | Ticker | SMTC (ticker) | SMTC_27f014ba | 2026-03-16 | earnings_transcript | ||||||||||||||
| Increased revenue contribution from HIFU's gain chips and the ramp of CW laser capacity and customer qualifications for 1.6T/3.2T transceivers. | for fiscal 2027, probably will be contributing roughly about a high-teen level of revenue (for gain chips); in a future period, we will provide more guidance on the revenue contribution from CW lasers | 2026-03-16 | 2027-01-31 | This acquisition expands Semtech's content opportunity in high-speed optical interconnects, and successful capacity expansion and design wins for CW lasers are critical for realizing the full strategic value and revenue potential. | Ticker | SMTC (ticker) | SMTC_0f9663ab | 2026-03-16 | earnings_transcript | ||||||||||||||
| Ring's launch of LoRa-powered sensors for security, safety, and home control applications on Amazon Sidewalk, starting in the U.S. | Ring plans to launch this product in the U.S. in March, followed by expansion across Canada, Mexico, Europe, Australia, and Japan | 2026-03-01 | 2027-03-16 | This represents a significant opportunity for mass-market consumer adoption of LoRa technology at Amazon's scale, potentially driving substantial revenue growth and validating LoRa's consumer readiness. | Ticker | SMTC (ticker) | SMTC_360b9a03 | 2026-03-16 | earnings_transcript | ||||||||||||||
| Achievement of over 50% year-over-year revenue growth in the data center segment for fiscal year 2027. | data center year-over-year revenue growth this fiscal year to exceed 50% | 2026-02-01 | 2027-01-31 | This aggressive growth target is a critical indicator of Semtech's successful transformation into an AI interconnect powerhouse and its ability to capitalize on the AI data center buildout, directly impacting valuation and investor sentiment. | Ticker | SMTC (ticker) | SMTC_86ca23a5 | 2026-03-16 | earnings_transcript | ||||||||||||||
| Successful ramp and accelerating shipments of 1.6T FiberEdge optical components and 1.6T CopperEdge ICs for Active Copper Cables (ACC). | launching in Q2 and gaining momentum in the second half of the year | 2026-05-01 | 2027-04-30 | These product ramps are critical drivers for Semtech's projected accelerating data center revenue growth throughout fiscal year 2027, validating its technology in next-generation AI interconnects. | Ticker | SMTC (ticker) | SMTC_5c6a1a5d | 2026-05-26 | earnings_transcript | ||||||||||||||
| Successful execution of capacity expansion plans for HieFo's indium phosphide gain chips and CW lasers. | by the end of this year, we can get the capacity increase by about 3, 4x and end of next year and it's going to be another 3, 4x | 2026-06-03 | 2027-12-31 | Addressing the current demand exceeding supply is crucial to fully capitalize on the strong market interest and revenue potential from these strategic components for 1.6T and 3.2T optical modules. | Ticker | SMTC (ticker) | SMTC_f62bf5f0 | 2026-05-26 | earnings_transcript | ||||||||||||||
| Finalization and ratification of the Active Copper Cable (ACC) Multi-Source Agreement (MSA) specifications. | still working on finalizing the specification | 2026-06-03 | 2026-12-31 | A finalized MSA would standardize ACC, accelerating its widespread adoption across the industry and potentially leading to more design wins and market penetration for Semtech's CopperEdge products. | Theme | SMTC (ticker) | SMTC_843bf73a | 2026-05-26 | earnings_transcript | ||||||||||||||
| Delivery of GPU‑accelerated EDA/Ansys products and Omniverse integrations under the NVIDIA partnership (management expects 'a number' of these products to be delivered in 2026). | in 2026 | 2026-01-01 | 2026-12-31 | GPU-accelerated tools and Omniverse connectors could materially improve performance, customer value and pricing power (bullish); failure to ship meaningful GPU-accelerated offerings or limited customer uptake would undermine expected product differentiation and upside from the NVIDIA partnership (bearish). | Ticker | SNPS (ticker) | SNPS_3fc73aac | 2026-02-25 | earnings_transcript | ||||||||||||||
| Availability and customer monetization (tape-outs/licenses) of key Design IP titles (HPC/interface IP) that management said are on track and expected to be Q4‑weighted. | a little bit more Q4 weighted / toward the latter part of the year | 2026-08-01 | 2026-10-31 | On‑time, silicon‑proven delivery and monetization would drive the expected back‑half recovery in the IP segment and reduce the 'transitional year' risk (bullish); further delays would keep IP revenue muted, pressuring FY26 growth and margins (bearish). | Ticker | SNPS (ticker) | SNPS_31241200 | 2026-02-25 | earnings_transcript | ||||||||||||||
| Closure of new NRE/royalty-based or bespoke IP commercialization deals with hyperscalers and other customers that management expects to convert from conversations to business in FY26. | in FY '26 | 2026-02-25 | 2026-10-31 | Conversion to recurring/royalty-based models with hyperscalers would materially improve long-term IP monetization and revenue quality (bullish); failure to close these deals would slow any structural improvement in IP revenue and prolong margin pressure (bearish). | Ticker | SNPS (ticker) | SNPS_36247223 | 2026-02-25 | earnings_transcript | ||||||||||||||
| Execution (timing and magnitude) of the newly replenished $2.0 billion stock repurchase authorization the Board approved following term‑loan repayment. | Board authorized to purchase up to $2 billion (opportunistic repurchases) | 2026-02-25 | 2026-10-31 | Material repurchases would reduce share count and be EPS‑accretive and signal confidence in cash generation (bullish); minimal or delayed repurchases (or diversion of cash to other uses) would reduce the near‑term EPS lift and could signal more conservative capital allocation (bearish). | Ticker | SNPS (ticker) | SNPS_c4a5d766 | 2026-02-25 | earnings_transcript | ||||||||||||||
| Commercial availability ramp of Multiphysics Fusion technology, with monetization expected to start in fiscal year 2027. | second half of 2026 | 2026-07-01 | 2026-12-31 | This product ramp is expected to drive meaningful productivity gains for customers and allow Synopsys to share in value creation, impacting EDA revenue and margins, and contributing to Ansys revenue synergies. | Ticker | SNPS (ticker) | SNPS_4e16e439 | 2026-05-27 | earnings_transcript | ||||||||||||||
| Sequential quarterly improvement in the Design IP segment's revenue performance, supported by pipeline and execution. | sequential quarterly improvement throughout the second half [of fiscal year 2026] | 2026-05-28 | 2026-10-31 | The IP business has been a drag, and its recovery is crucial for the overall growth narrative and validating the strategic pivot towards higher-value monetization, impacting revenue and investor sentiment. | Ticker | SNPS (ticker) | SNPS_84c9a705 | 2026-05-27 | earnings_transcript | ||||||||||||||
| Signing of agreements with a few customers for a new, higher-value IP business model, particularly with hyperscalers for HPC and AI-based chips. | by the end of this fiscal year [FY26] | 2026-06-10 | 2026-10-31 | These initial agreements are crucial proof points for the new IP monetization strategy, aiming to capture more value and accelerate growth in the IP segment, positively impacting revenue and margins. | Ticker | SNPS (ticker) | SNPS_503817f4 | 2026-05-27 | earnings_transcript | ||||||||||||||
| Evolution of the monetization model for AI-driven EDA capabilities to a subscription-plus-consumption model. | as agents become more pervasive in our customers' workflow | 2026-06-10 | 2027-12-31 | A successful shift to a new monetization model for agentic AI could significantly increase value capture and drive higher revenue and margins for the EDA and S&A businesses. | Ticker | SNPS (ticker) | SNPS_9fff1ee6 | 2026-05-27 | earnings_transcript | ||||||||||||||
| Conversion of Intel Foundry and other advanced node evaluations into production commitments for Synopsys IP. | as these wins move from an eval into production | 2026-06-10 | 2027-12-31 | This would provide upside to IP revenue beyond current guidance, as Synopsys gets paid once customers commit to production, signaling strong demand for their foundational and interface IP at advanced nodes. | Ticker | SNPS (ticker) | SNPS_03c56394 | 2026-05-27 | earnings_transcript | ||||||||||||||
| Synopsys Investor Day to discuss strategy for value capture, margin expansion, long-term opportunities, and provide further details on remaining Ansys synergy realization. | September 30, 2026 | 2026-09-30 | 2026-09-30 | This event could materially impact investor sentiment and valuation based on new strategic insights, updated long-term financial targets, and details on monetization strategies for AI and IP, as well as the path to full synergy realization. | Ticker | SNPS (ticker) | SNPS_d8ddc9d3 | 2026-05-27 | earnings_transcript | ||||||||||||||
| Broadcom beginning production of silicon for OpenAI's AI accelerators. | production late 2026 | 2026-10-01 | 2026-12-31 | This marks a significant milestone in Broadcom's partnership with OpenAI, a major AI frontier lab, and is crucial for its projected AI semiconductor revenue growth in 2027 and beyond. | Ticker | AVGO (ticker) | AVGO_3121e94d | 2026-06-03 | earnings_transcript | ||||||||||||||
| Execution and delivery of an $11 billion order of TPU 'ironwood' racks to Anthropic (management stated the $11B order is for delivery in late 2026). | delivery in late 2026 | 2026-10-01 | 2026-12-31 | Successful on-time delivery drives revenue recognition, backlog conversion and AI semiconductor/networks revenue in 2026; delays, cancellations or supply constraints would reduce near-term revenue and could worsen concentration risk and investor sentiment. | Ticker | AVGO (ticker) | AVGO_f8456d4a | 2025-12-11 | earnings_transcript | ||||||||||||||
| Delivery and execution of a $1 billion order from Broadcom's fifth XPU (customer accelerator) customer, noted as for delivery in late 2026. | delivery in late 2026 | 2026-10-01 | 2026-12-31 | Adds to AI backlog conversion and customer diversification; on-time execution supports FY2026 revenue and cementing design-win momentum, while delays or cancellations would reduce expected AI revenue and weaken investor confidence in broadening customer base. | Ticker | AVGO (ticker) | AVGO_98b78f53 | 2025-12-11 | earnings_transcript | ||||||||||||||
| Lattice Semiconductor, inclusive of the AMI acquisition, is expected to exceed a $1 billion annual revenue run rate. | by the end of this year | 2026-10-01 | 2026-12-31 | This milestone indicates significant financial growth for the combined entity and validates the strategic expansion and successful integration of the AMI acquisition, potentially driving positive investor sentiment. | Ticker | LSCC (ticker) | LSCC_147cfbd9 | 2026-05-04 | earnings_transcript | ||||||||||||||
| Meaningful EPS accretion from the AMI acquisition. | starting in Q4 | 2026-10-01 | 2026-12-31 | This indicates the successful financial integration of AMI and its positive impact on Lattice's profitability, validating the acquisition's strategic value. | Ticker | LSCC (ticker) | LSCC_0b462784 | 2026-08-04 | earnings_transcript | ||||||||||||||
| Melexis shares will start trading ex-coupon for the interim dividend of EUR 1.3 gross per share. | October 13, 2026, opening of the market | 2026-10-13 | 2026-10-13 | This is a direct financial event for shareholders, impacting the stock price around the ex-dividend date and reflecting the company's capital allocation policy. | Ticker | MELE.BR (ticker) | MELE.BR_568080da | 2026-07-29 | earnings_transcript | ||||||||||||||
| Broadcom's actual AI semiconductor revenue for fiscal year 2027 compared to its reiterated guidance of 'in excess of $100 billion'. | fiscal year 27 | 2026-11-01 | 2027-10-31 | This ambitious long-term target is a major driver of Broadcom's valuation. Achieving or exceeding it would be a significant bullish catalyst, while any shortfall could materially impact investor sentiment. | Ticker | AVGO (ticker) | AVGO_539a5499 | 2026-06-03 | earnings_transcript | ||||||||||||||
| Initial revenue recognition / commercial sales from Synopsys‑Ansys joint solutions, which management expects to begin in fiscal 2027. | monetization of the joint solution to start in FY '27 | 2026-11-01 | 2027-10-31 | If monetization begins in FY27 as guided, it provides an early revenue tail to justify merger rationale and the stated revenue synergies; failure to monetize on schedule would delay revenue upside and weaken the merger ROI thesis (bearish). | Ticker | SNPS (ticker) | SNPS_db23c661 | 2026-02-25 | earnings_transcript | ||||||||||||||
| Execution of the multi‑year alignment/agreement with OpenAI to support ~10 gigawatts of capacity across the 2027–2029 timeframe (management referenced the 10 GW alignment running through '27–'29). | 2027 through 2029 | 2027-01-01 | 2029-12-31 | If executed as anticipated, this multi-year power/build program could represent a material multi-year demand stream for Broadcom systems/components; if it under‑delivers or is delayed, expected medium-term revenue and visibility into large hyperscaler demand would be impaired. | Ticker | AVGO (ticker) | AVGO_2a830b86 | 2025-12-11 | earnings_transcript | ||||||||||||||
| Broadcom management stated line-of-sight to AI revenue from chips, just chips, exceeding $100 billion in 2027. | in excess of $100 billion in 2027 | 2027-01-01 | 2027-12-31 | If realized, it represents a multi-year, high-scale AI compute monetization that could meaningfully lift revenue and inform valuation, though it may pressure margins if AI mix grows faster than mix shifts in other segments. | Ticker | AVGO (ticker) | AVGO_bfe6a053 | 2026-03-04 | earnings_transcript | ||||||||||||||
| OpenAI deploying in volume their first-generation XPU in 2027 at over 1 gigawatt of compute capacity. | in 2027 | 2027-01-01 | 2027-12-31 | OpenAI demand is a key driver for Broadcom's XPUs; a meaningful ramp would support backlog realization and top-line growth, though execution risk and timing remain uncertain. | Ticker | AVGO (ticker) | AVGO_6fd62a9a | 2026-03-04 | earnings_transcript | ||||||||||||||
| Next-generation Tomahawk 7 switch featuring 2x the performance. | in 2027 | 2027-01-01 | 2027-12-31 | Higher bandwidth networking leadership supports AI compute expansion and could accelerate share gains in AI networking. | Ticker | AVGO (ticker) | AVGO_ed84ae9b | 2026-03-04 | earnings_transcript | ||||||||||||||
| Western Digital expects to ramp volume production of its HAMR (Heat-Assisted Magnetic Recording) drives. | expect to ramp that in 2027 | 2027-01-01 | 2027-12-31 | The successful ramp of HAMR technology is critical for future high-capacity drives, enabling further aerial density improvements and cost reductions, which are essential for maintaining competitive leadership and supporting long-term revenue and margin growth in the HDD market. | Ticker | WDC (ticker) | WDC_edadcd2c | 2026-04-30 | earnings_transcript | ||||||||||||||
| New capacity from the JPY 94 billion CapEx decision (80% for capacity expansion in AI, data center, digital power at Kofu, Naka, Saijo factories, and back-end processes) starting to contribute to production. | beginning of next year | 2027-01-01 | 2027-03-31 | Increased capacity is crucial for Renesas to capture strong demand, especially in AI/data center and digital power, and to resolve supply constraints in the long term, supporting revenue growth and market share. | Ticker | 6723.T (ticker) | 6723.T_af670256 | 2026-04-23 | earnings_transcript | ||||||||||||||
| OEMs are expected to launch a significant number of new automotive platforms in 2027. | '27 will be different. And in '27, they forecast a lot of new platform | 2027-01-01 | 2027-12-31 | New platforms are typically more electronic-rich, offering increased content opportunities for Melexis' products, which could drive significant revenue growth in the longer term. | Theme | MELE.BR (ticker) | MELE.BR_c5a535a1 | 2026-02-04 | earnings_transcript | ||||||||||||||
| Development and customer adoption of DWDM lasers optimized for CPO (Co-Packaged Optics) scale-up applications based on the OCI MSA. | more for 2028 opportunities | 2027-05-01 | 2028-12-31 | This strategic investment positions Semtech to participate meaningfully in future high-density, low-power optical solutions, expanding its addressable market in next-generation data center architectures. | Ticker | SMTC (ticker) | SMTC_c3a0d85e | 2026-05-26 | earnings_transcript | ||||||||||||||
| Linearized solutions (LPO/LRO) achieving 25% +/- of the total transceiver market mix. | in a year or 2 timeframe | 2027-06-03 | 2028-06-03 | This market shift would significantly benefit Semtech's FiberEdge LPO/LRO products, driving market share gains and revenue growth as hyperscalers prioritize power-efficient optical solutions. | Theme | SMTC (ticker) | SMTC_cd1c07a8 | 2026-05-26 | earnings_transcript | ||||||||||||||
| Next-step upgrade to 400G SerDes in 2028. | in 2028 | 2028-01-01 | 2028-12-31 | 400G SerDes upgrade enables higher bandwidth within data-center clusters; could influence ASPs, mix and gross margins during the transition period. | Ticker | AVGO (ticker) | AVGO_c74214d3 | 2026-03-04 | earnings_transcript | ||||||||||||||
| Coherent light modules, utilizing Semtech's DFB lasers and other components, ramping into production for scale-across data center applications. | mid-2028 in production | 2028-05-01 | 2028-07-31 | This represents a significant future market opportunity for Semtech, leveraging its HieFo acquisition to drive long-term revenue growth in high-bandwidth data center interconnects. | Ticker | SMTC (ticker) | SMTC_7e245f13 | 2026-05-26 | earnings_transcript |
NotesMarket Commentary
| Date | Type | Comment | Detail | Sentiment | Tickers |
|---|---|---|---|---|---|
| 2026-06-20 | Theme Refresh Synthesis | The AI '24: IC and Components theme remains strongly bullish, driven by accelerating AI demand and massive hyperscaler investments. Broadcom's record AI semiconductor revenue and long-term deals, alongside Synopsys's AI-driven EDA demand and ADI's power solutions, confirm this. Semtech's strong data center growth highlights interconnect demand, but its capacity constraints underscore persistent supply chain challenges, a key theme risk. The market is highly sensitive to guidance, as seen with AVGO's stock reaction. | Market Commentary | Bullish | ADI, SMTC, AVGO, MPWR, 6723.T, MELE.BR, SNPS, RMBS, QCOM, TTMI, MTSI, LSCC |
Constituents
- AVGOT2— Broadcom Inc.
- RMBST2— Rambus Inc.
- WDCT2— Western Digital Corporation
- 2454.TWT3— MediaTek Inc.
- 6723.TT3— Renesas Electronics Corporation
- ADIT3— Analog Devices, Inc.
- LSCCT3— Lattice Semiconductor Corporation
- MELE.BRT3— Melexis N.V.
- MPWRT3— Monolithic Power Systems, Inc.
- MTSIT3— MACOM Technology Solutions Holdings, Inc.
- QCOMT3— QUALCOMM Incorporated
- SMTCT3— Semtech Corporation
- SNPST3— Synopsys, Inc.
- TTMIT3— TTM Technologies, Inc.
- 007660.KOT3· no notes yet
- 3702.TWT3· no notes yet
- AOSLT3· no notes yet
- AWE.LSET3· no notes yet
- QRVOT3· no notes yet
- SWKST3· no notes yet