Home / Themes / AI '26: Advanced Chip Packaging
AI '26: Advanced Chip Packaging
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Theme thesis · 2 uploads · 4/5 sections · Tickers 10 with notes · 3 pending
Bull / Bear Details has the investment thesis and bull/bear points. Overview is monitoring guidance (hiring, forums, second-order trends, search keywords, Google Trends, datasets).
Bull / Bear DetailsThe Advanced Chip Packaging theme is poised for significant growth driven by the escalating demands of AI for high-performance, power-efficient, and densely int
Thesis
The Advanced Chip Packaging theme is poised for significant growth driven by the escalating demands of AI for high-performance, power-efficient, and densely integrated semiconductors, particularly HBM and chiplet architectures, necessitating complex testing and innovative bonding technologies.
Bull case
Surging demand for AI accelerators and High Bandwidth Memory (HBM) directly drives the need for advanced packaging solutions to integrate these components, with HBM content per accelerator rapidly increasing and requiring rigorous, multi-stage testing.
The ongoing technological evolution towards hybrid bonding (e.g., for HBM4E) and increasingly complex chiplet architectures demands specialized and precise packaging, testing, and assembly processes, creating significant value-add opportunities for advanced packaging providers.
The expansion of the advanced packaging ecosystem extends beyond direct assembly to include critical upstream and downstream subsystems, such as advanced testing equipment, wafer probes, and thermal controls, which see disproportionate growth due to increased process steps per wafer for AI chips.
Bear case
The inherent cyclicality of the broader semiconductor industry, particularly the risk of overcapacity in memory production, could eventually lead to a moderation in demand for advanced packaging services, impacting revenue and profitability.
Significant capital expenditure and technological hurdles associated with scaling new advanced packaging technologies like hybrid bonding and MEMS manufacturing capacity could lead to delays, increased costs, or slower-than-anticipated adoption rates.
Competitive pressures, including the potential for large semiconductor manufacturers (OEMs) to insource advanced packaging or subsystem manufacturing, could limit the market share and growth opportunities for independent advanced packaging and subsystem vendors.
Key Metrics
| Metric | Cadence | What It Signals | Update Source |
|---|---|---|---|
| Global Advanced Packaging Market Revenue Growth (Year-over-Year %) | Annually | Sustained high growth indicates strong demand for advanced chip integration, driven by AI and HPC, supporting a bullish outlook for the theme. | LLM_Approved |
| High Bandwidth Memory (HBM) Market Revenue Growth (Year-over-Year %) | Annually/Quarterly | Rapid growth signifies increasing adoption of HBM in AI accelerators and high-performance computing, indicating a strong tailwind for advanced packaging. | LLM_Approved |
| Hybrid Bonding Equipment Market Revenue Growth (Year-over-Year %) | Annually | Accelerating growth in hybrid bonding equipment sales indicates increasing industry investment in next-generation advanced packaging, crucial for future AI chip performance. | LLM_Approved |
Upcoming Catalysts
| Catalyst ID | Estimated Timing | Estimated Date Start | Estimated Date End | Catalyst | Why It Matters | Ticker Or Theme Specific | Transcript Date | Source Type | Catalyst Source |
|---|---|---|---|---|---|---|---|---|---|
| SNPS_89fbabea | first half of 2026 | 2026-01-01 | 2026-06-30 | Delivery of the first wave of integrated Synopsys‑Ansys products (joint solutions) that management said would be delivered in H1 2026. | Successful delivery (and subsequent customer validation) would validate cross-product integration plans and underpin future revenue synergies and cross‑sell; delays or underwhelming capability would push out monetization and increase integration execution risk, pressuring growth and valuation. | Ticker | 2026-02-25 | earnings_transcript | SNPS (ticker) |
| SNPS_3fc73aac | in 2026 | 2026-01-01 | 2026-12-31 | Delivery of GPU‑accelerated EDA/Ansys products and Omniverse integrations under the NVIDIA partnership (management expects 'a number' of these products to be delivered in 2026). | GPU-accelerated tools and Omniverse connectors could materially improve performance, customer value and pricing power (bullish); failure to ship meaningful GPU-accelerated offerings or limited customer uptake would undermine expected product differentiation and upside from the NVIDIA partnership (bearish). | Ticker | 2026-02-25 | earnings_transcript | SNPS (ticker) |
| SNPS_36247223 | in FY '26 | 2026-02-25 | 2026-10-31 | Closure of new NRE/royalty-based or bespoke IP commercialization deals with hyperscalers and other customers that management expects to convert from conversations to business in FY26. | Conversion to recurring/royalty-based models with hyperscalers would materially improve long-term IP monetization and revenue quality (bullish); failure to close these deals would slow any structural improvement in IP revenue and prolong margin pressure (bearish). | Ticker | 2026-02-25 | earnings_transcript | SNPS (ticker) |
| SNPS_c4a5d766 | Board authorized to purchase up to $2 billion (opportunistic repurchases) | 2026-02-25 | 2026-10-31 | Execution (timing and magnitude) of the newly replenished $2.0 billion stock repurchase authorization the Board approved following term‑loan repayment. | Material repurchases would reduce share count and be EPS‑accretive and signal confidence in cash generation (bullish); minimal or delayed repurchases (or diversion of cash to other uses) would reduce the near‑term EPS lift and could signal more conservative capital allocation (bearish). | Ticker | 2026-02-25 | earnings_transcript | SNPS (ticker) |
| AMKR_6ce2607d | meeting construction milestones of our Arizona facility | 2026-01-01 | 2027-06-30 | Amkor to meet construction milestones for Phase One of its Arizona advanced packaging campus, with building completion targeted for mid-2027. | On-time construction is crucial for establishing a U.S. domestic supply chain for advanced packaging, securing future customer engagements, and realizing the long-term strategic benefits of the facility. | Ticker | 2026-02-09 | earnings_transcript | AMKR (ticker) |
| AMKR_283095f1 | continuing in Q1 | 2026-01-01 | 2026-12-31 | Amkor to continue the profitable ramp-up of its Vietnam facility, including the successful migration of SiP products from Korea. | Continued profitability and efficient migration in Vietnam are key to recovering the 90 basis point gross margin headwind from 2025 and freeing up valuable manufacturing space in Korea for HDFO and test growth. | Ticker | 2026-02-09 | earnings_transcript | AMKR (ticker) |
| AMKR_9fd37444 | ongoing in 2026 | 2026-01-01 | 2026-12-31 | Amkor to resolve R&D and New Product Introduction (NPI) constraints in Korea to effectively prioritize and support larger advanced packaging opportunities. | Overcoming these constraints is crucial for Amkor to maximize its capacity utilization, accelerate new program qualifications, and fully capture the strong demand in advanced packaging, particularly for AI/HPC. | Ticker | 2026-02-09 | earnings_transcript | AMKR (ticker) |
| AMKR_519c78ee | discussion continues | 2026-01-01 | 2027-06-30 | Amkor to further develop and formalize its partnership with TSMC regarding technology alignment and manufacturing needs for the Arizona facility. | A strong partnership with a leading foundry like TSMC is vital for securing technology roadmaps, customer commitments, and the overall success and utilization of Amkor's advanced packaging capabilities in the U.S. | Ticker | 2026-02-09 | earnings_transcript | AMKR (ticker) |
| AMKR_55627ff4 | this year | 2026-01-01 | 2026-12-31 | Amkor may pursue debt financing to supplement its existing liquidity and government incentives for its significant 2026 capital expenditures. | The timing and magnitude of any debt issuance could impact Amkor's balance sheet, interest expense, and overall financial flexibility as it funds its aggressive expansion plans. | Ticker | 2026-02-09 | earnings_transcript | AMKR (ticker) |
| AMKR_f26f4ca1 | expect to continue that slow progression out of the trough | 2026-01-01 | 2026-12-31 | Amkor to experience continued slow recovery in the mainstream automotive market. | While advanced automotive is strong, a sustained recovery in mainstream automotive would contribute to the single-digit growth expected for the remainder of the business, supporting overall revenue. | Ticker | 2026-02-09 | earnings_transcript | AMKR (ticker) |
| AMKR_eeaa15eb | ongoing, some executed, others in discussion | 2026-05-03 | 2027-12-31 | Securing and realizing government incentives (CHIPS grant, investment tax credit) and additional customer contributions for the Arizona facility. | These funds are crucial for mitigating the financial risk of the significant CapEx investment ($2.5B-$3B in 2026, elevated through 2027) and ensuring balance sheet stability during the expansion phase. | Ticker | 2026-04-27 | earnings_transcript | AMKR (ticker) |
| AMKR_5ed5dea6 | increased over the last few months | 2026-05-03 | 2026-12-31 | Continued or escalating geopolitical events in the Middle East leading to sustained or increased pressure on material pricing. | Higher material costs could negatively impact gross margins if Amkor cannot fully offset them through pricing adjustments with customers. | Theme | 2026-04-27 | earnings_transcript | AMKR (ticker) |
| AMKR_c57c3b02 | closely monitoring | 2026-05-03 | 2027-05-03 | Changes or new developments in export controls and trade policies, particularly between the U.S. and China, affecting AI products or semiconductor supply chains. | Could impact demand, supply chain dynamics, and market access for certain products, potentially affecting revenue or operational flexibility. | Theme | 2026-04-27 | earnings_transcript | AMKR (ticker) |
| BESI.AS_ffdb77d7 | early Q2, maybe Q2, May, June time frame | 2026-05-01 | 2026-06-30 | Samsung to clarify its adoption strategy for hybrid bonding in HBM4 and 12-stack memory production. | This decision will indicate the volume and timeline for hybrid bonding in HBM, significantly impacting Besi's order intake and revenue from memory customers. Bullish if high-volume adoption is confirmed, bearish if delayed or alternative technologies are prioritized. | Ticker | 2026-02-19 | earnings_transcript | BESI.AS (ticker) |
| BESI.AS_ad1b9fa9 | second quarter of this year to also come towards the end of this year to the conclusion | 2026-04-01 | 2026-12-31 | The third major memory producer (Korean-based) to conclude its qualification of hybrid bonding for HBM4 or next-generation HBM (20-stack). | A positive conclusion and subsequent adoption would open a significant new revenue stream for Besi in the HBM market, validating hybrid bonding's performance advantages and expanding Besi's customer base. | Ticker | 2026-02-19 | earnings_transcript | BESI.AS (ticker) |
| BESI.AS_a10e39c7 | on the horizon | 2026-01-01 | 2027-12-31 | A major end customer (e.g., for high-end smartphones or AI computing) to adopt hybrid bonding for a new product line. | This would create significantly higher demand for Besi's hybrid bonders, driving substantial revenue growth and validating the technology for mainstream high-volume applications beyond current logic customers. | Ticker | 2026-02-19 | earnings_transcript | BESI.AS (ticker) |
| BESI.AS_a2e3d1fb | on the brink of changing from reflow process designs to hybrid bonded designs | 2026-01-01 | 2026-12-31 | Major AI providers currently using mass reflow or TC for certain modules to switch to hybrid bonding for mainstream logic applications. | This transition would dramatically increase demand for Besi's hybrid bonding systems, leading to significant revenue and market share gains in the rapidly expanding AI computing segment. | Ticker | 2026-02-19 | earnings_transcript | BESI.AS (ticker) |
| BESI.AS_35d2775f | once that becomes the mainstream | 2026-01-01 | 2027-12-31 | A major memory producer to adopt TC NXT as a mainstream technology for next-generation memory devices. | This would validate Besi's TC NXT technology for high-volume memory applications, expanding its market opportunity for bond pad pitches below 20 microns and providing an alternative to hybrid bonding where cost is a primary factor. | Ticker | 2026-02-19 | earnings_transcript | BESI.AS (ticker) |
| INTC_987eaa61 | full year | 2026-01-01 | 2026-12-31 | Intel achieving positive adjusted free cash flow for the full year 2026, excluding the Fab 34 joint investment buyout. | Positive free cash flow is a key indicator of financial health and ability to fund operations and debt repayment; failure to achieve this would be bearish for investor sentiment and valuation. | Ticker | 2026-04-23 | earnings_transcript | INTC (ticker) |
| INTC_4bdeb86f | strong year of double-digit unit growth for the industry and for us with momentum extending into 2027. | 2026-01-01 | 2026-12-31 | Achievement of strong double-digit unit growth for server CPUs in 2026 for both Intel and the industry. | Strong server CPU demand is a significant driver for DCAI revenue and overall profitability; actual growth higher or lower than expected would materially impact results and investor sentiment. | Ticker | 2026-04-23 | earnings_transcript | INTC (ticker) |
| INTC_f5a9fa98 | 2026 | 2026-01-01 | 2026-12-31 | Operating expenses for 2026 are likely to be higher than the previously targeted $16 billion due to inflationary pressures, variable compensation, and targeted investments. | Higher OpEx directly impacts Intel's operating profit and earnings per share; the actual increase and its impact on profitability are uncertain and could affect valuation. | Ticker | 2026-04-23 | earnings_transcript | INTC (ticker) |
| INTC_ba21db50 | 2026 | 2026-01-01 | 2026-12-31 | Intel's capital expenditures for 2026 are forecast to be flat year-over-year, an increase from the prior expectation of flat to down. | Increased CapEx reflects higher investment in capacity to support committed demand, which is bullish for future supply but could impact free cash flow and short-term profitability. | Ticker | 2026-04-23 | earnings_transcript | INTC (ticker) |
| INTC_5e33af1e | this year | 2026-04-28 | 2026-12-31 | Intel's retirement of $2.5 billion in debt maturities coming due in 2026. | Successful debt retirement strengthens the balance sheet and reduces future interest expense, signaling financial discipline; failure to do so would be bearish for credit ratings and investor confidence. | Ticker | 2026-04-23 | earnings_transcript | INTC (ticker) |
| ONTO_8a7dbb81 | evaluations to complete in the first half of 2026 with volume ramps in the second half of 2026 | 2026-01-01 | 2026-12-31 | Customer qualification conversions and volume ramp of Onto's next-generation Dragonfly (G5) inspection systems following multiple on-site evaluations. | Bull: Successful qualification-to-volume ramps would drive substantial incremental systems revenue and market share in 2.5D/3D packaging and HBM in 2H26; Bear: prolonged evaluations or weak conversion would reduce 2H26 upside, slow revenue growth and weaken investor confidence. | Ticker | 2026-02-19 | earnings_transcript | ONTO (ticker) |
| ONTO_94754e2b | volume order conversion and production ramp in 2026 | 2026-01-01 | 2026-12-31 | Conversion of 3Di 3D/surface metrology qualifications into volume purchase orders and production-line installs for HBM4 and other advanced packaging customers. | Bull: Volume 3Di orders would add 'tens of millions' to 2026 revenue and strengthen Onto's technological moat in pre-reflow HBM metrology; Bear: delays, failed conversions or competitive displacements would materially reduce expected packaging revenue and valuation upside. | Ticker | 2026-02-19 | earnings_transcript | ONTO (ticker) |
| ONTO_b3d6adf5 | second quarter 2026 (management expects revenue exceeding $300 million) | 2026-04-01 | 2026-06-30 | Reported Q2 2026 revenue exceeding $300 million as a check on accelerating demand and backlog conversion. | Bull: Q2 >$300M would confirm the accelerating top-line trajectory and underpin management's 12–14% H1 core growth claim; Bear: failure to reach this milestone would indicate slower conversion of evaluations/backlog and reduce 2026 upside. | Ticker | 2026-02-19 | earnings_transcript | ONTO (ticker) |
| ONTO_84ad653d | first quarter 2026 (first full quarter contribution) and full-year 2026 integration outcomes | 2026-01-01 | 2026-12-31 | Realized revenue, margin and cross-sell contribution from the Semilab acquisition (first full quarter of contribution in Q1 2026; management cited ~$100–110M potential revenue for Semilab in 2026). | Bull: Semilab meeting or exceeding revenue and integration targets would be accretive to 2026 revenue and margins and de-risk the expanded TAM claim; Bear: integration issues or weaker-than-expected Semilab sales (e.g., power semi weakness) would reduce expected accretion and margin expansion. | Ticker | 2026-02-19 | earnings_transcript | ONTO (ticker) |
| ONTO_eb4c53a7 | over the first half of 2026 (management noted supplier strain and gradual extension of lead times) | 2026-01-01 | 2026-06-30 | Potential supplier lead-time extensions (notably precision optics and other fixed-lead-time components) that could delay tool deliveries and constrain ability to meet customer pull-ins. | Extended lead times could bottleneck shipments and defer revenue recognition, reducing near-term growth and pressuring margins; effective supplier management would preserve the guided ramp and revenue cadence. | Ticker | 2026-02-19 | earnings_transcript | ONTO (ticker) |
| ONTO_f51020af | 2026 (timing hinges on how quickly new cleanroom space becomes available) | 2026-01-01 | 2026-12-31 | Industry-level availability and timing of new cleanroom/fab capacity expansions (TSMC and hyperscaler factory builds) that determine how quickly WFE and advanced-packaging demand can absorb new tools. | Theme-level: Faster completion of cleanroom/fab capacity would accelerate WFE and packaging tool orders (bull), while delays would cap 2026 WFE growth forecasts and reduce demand visibility for Onto and peers (bear). | Theme | 2026-02-19 | earnings_transcript | ONTO (ticker) |
| AMKR_525e36ea | second half of the year | 2026-07-01 | 2026-12-31 | Amkor to launch two new High-Density Fan-Out (HDFO) programs for AI data centers into high-volume production in Korea. | This is critical for Amkor to achieve its projected nearly tripling of HDFO/2.5D revenue in 2026 and capitalize on AI/HPC demand, significantly impacting computing segment growth and overall revenue. | Ticker | 2026-02-09 | earnings_transcript | AMKR (ticker) |
| AMKR_c3b218a5 | over the course of this year | 2026-07-01 | 2026-12-31 | Amkor to successfully achieve the projected steep ramp and high-volume production for its new HDFO programs supporting AI data centers. | Successful execution of these ramps is essential for Amkor to meet its aggressive computing segment growth targets (over 20% for 2026) and capitalize on the strong demand for AI/HPC advanced packaging. | Ticker | 2026-02-09 | earnings_transcript | AMKR (ticker) |
| AMKR_9c6e7aec | second half of the year | 2026-07-01 | 2026-12-31 | High-volume ramp of advanced packaging programs, including the new data center CPU program, in Korea. | Successful ramps are crucial for achieving full-year revenue growth targets, especially the tripling of AI advanced packaging revenue, and improving utilization and margins. Delays would negatively impact results and sentiment. | Ticker | 2026-04-27 | earnings_transcript | AMKR (ticker) |
| AMKR_c42cbbad | second half of the year | 2026-07-01 | 2026-12-31 | Achievement of gross margins in the mid-to-high teens, driven by increased utilization, favorable product mix from advanced packaging, and pricing increases. | This is a key profitability target for the second half, indicating the success of operational excellence and strategic shift towards higher-value advanced packaging. Failure to achieve this would negatively impact earnings. | Ticker | 2026-04-27 | earnings_transcript | AMKR (ticker) |
| INTC_8ad9c34e | beginning in the second half of 2026 and expanding into the first half of 2027 | 2026-07-01 | 2027-06-30 | Emergence of external customer design commitments for Intel's 14A process technology. | Securing external customers for Intel Foundry's 14A process is crucial for the long-term success and profitability of the foundry business, validating Intel's process technology and driving future revenue. | Ticker | 2026-04-23 | earnings_transcript | INTC (ticker) |
| INTC_4412bd7b | second half of the year | 2026-07-01 | 2026-12-31 | Weakening PC demand in the second half of 2026, leading to a low double-digit decline in full-year PC unit Total Addressable Market (TAM). | Weak PC demand directly impacts CCG revenue and overall company performance; a worse-than-expected decline would be bearish, while resilience would be bullish. | Theme | 2026-04-23 | earnings_transcript | INTC (ticker) |
| INTC_6747324d | second half | 2026-07-01 | 2026-12-31 | Rising input costs, particularly for memory, wafers, and substrates, creating headwinds for Intel's gross margins. | Increased costs directly pressure gross margins, impacting profitability; the ability to offset these costs through pricing or efficiencies will be key to financial performance. | Ticker | 2026-04-23 | earnings_transcript | INTC (ticker) |
| SNPS_31241200 | a little bit more Q4 weighted / toward the latter part of the year | 2026-08-01 | 2026-10-31 | Availability and customer monetization (tape-outs/licenses) of key Design IP titles (HPC/interface IP) that management said are on track and expected to be Q4‑weighted. | On‑time, silicon‑proven delivery and monetization would drive the expected back‑half recovery in the IP segment and reduce the 'transitional year' risk (bullish); further delays would keep IP revenue muted, pressuring FY26 growth and margins (bearish). | Ticker | 2026-02-25 | earnings_transcript | SNPS (ticker) |
| AMKR_4767d0b6 | at the end of this year | 2026-10-01 | 2026-12-31 | Completion of the new test building in Korea, providing incremental space to support data center demand. | This expansion is critical to support the growing demand for data center applications and advanced packaging, alleviating potential capacity constraints going into 2027. | Ticker | 2026-04-27 | earnings_transcript | AMKR (ticker) |
| SNPS_db23c661 | monetization of the joint solution to start in FY '27 | 2026-11-01 | 2027-10-31 | Initial revenue recognition / commercial sales from Synopsys‑Ansys joint solutions, which management expects to begin in fiscal 2027. | If monetization begins in FY27 as guided, it provides an early revenue tail to justify merger rationale and the stated revenue synergies; failure to monetize on schedule would delay revenue upside and weaken the merger ROI thesis (bearish). | Ticker | 2026-02-25 | earnings_transcript | SNPS (ticker) |
| AMKR_a6d1ab7a | come in on a lag | 2027-01-01 | 2027-12-31 | Amkor to receive government incentives, including investment tax credits and grants, for its Arizona advanced packaging facility. | These incentives are a significant funding source (upwards of $2.85 billion) for the multi-billion dollar Arizona project, mitigating financial risk and improving return on investment. | Ticker | 2026-02-09 | earnings_transcript | AMKR (ticker) |
| AMKR_f52a5d0d | beginning in 2027 | 2027-01-01 | 2027-12-31 | Operating income margin dilution of approximately 1% to 2% due to depreciation and start-up costs for the Arizona facility, recognized in OpEx. | This will temporarily impact profitability and operating income margins in 2027 before the facility scales and contributes meaningful revenue and higher margins in later years. | Ticker | 2026-04-27 | earnings_transcript | AMKR (ticker) |
| AMKR_2314b210 | planned to be completed in 2027 | 2027-01-01 | 2027-12-31 | Completion of Phase 1 construction of the Arizona advanced packaging campus. | This milestone is essential for bringing the new U.S. manufacturing capacity online, which is a key part of Amkor's long-term strategic expansion and geographic diversification. Delays would impact future revenue ramps. | Ticker | 2026-04-27 | earnings_transcript | AMKR (ticker) |
| INTC_5990c1d5 | Coral Rapid is coming up strong | 2027-01-01 | 2028-12-31 | Launch of Intel's Coral Rapid CPUs, featuring multithreading capabilities. | This product is critical for Intel's competitive positioning against AMD in the server CPU market, potentially leading to market share gains and improved Data Center and AI (DCAI) performance. | Ticker | 2026-04-23 | earnings_transcript | INTC (ticker) |
| INTC_d1ea1eec | 2027 | 2027-01-01 | 2027-12-31 | Intel's commitment to retire $3.8 billion in debt maturities coming due in 2027. | Successful debt retirement strengthens the balance sheet and reduces future interest expense, signaling financial discipline; failure to do so would be bearish for credit ratings and investor confidence. | Ticker | 2026-04-23 | earnings_transcript | INTC (ticker) |
NotesMarket Commentary
| Date | Type | Comment | Detail | Sentiment | Tickers | IS CHANGE |
|---|---|---|---|---|---|---|
| 2026-03-04 | group_thesis | The transcript strongly reinforces the Advanced Chip Packaging theme by detailing the escalating complexity and testing demands of HBM, the critical transition to hybrid bonding (HBM4E/HBM5) with key beneficiaries like BESI and ASMPT, and the expanding opportunities in advanced packaging subsystems and manufacturing intelligence (PDFS, PTI). This underpins sustained investment in the sector. | Market Commentary | Bullish | BESI, ASMPT (522 HK), PTI (6239 TT), PDFS, FORM, ONTO, TER, COHU | False |
Constituents
- — Synopsys, Inc.
- — KLA Corporation
- — Teradyne, Inc.
- AMATT2— Applied Materials, Inc.
- AMKRT2— Amkor Technology, Inc.
- BESI.AST2— BE Semiconductor Industries N.V.
- FORMT2— FormFactor, Inc.
- INTCT2— Intel Corporation
- ONTOT2— Onto Innovation Inc.
- PDFST2— PDF Solutions, Inc.
- 0552.HKT2· no notes yet
- 6961.TT2· no notes yet
- KLICT2· no notes yet