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AI '25: Semiconductors (open on stockthemes)

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Theme thesis · 5/5 sections · Tickers 23 with notes · 2 pending

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Bull / Bear Details has the investment thesis and bull/bear points. Overview is monitoring guidance (hiring, forums, second-order trends, search keywords, Google Trends, datasets).

Bull / Bear Details

Artificial intelligence is driving a structural expansion in semiconductor demand as increasingly complex training and inference workloads require specialized a

Thesis

Artificial intelligence is driving a structural expansion in semiconductor demand as increasingly complex training and inference workloads require specialized accelerators, custom processors, high-bandwidth memory, advanced manufacturing, and sophisticated packaging. The AI computing buildout creates opportunities across chip designers, memory manufacturers, foundries, equipment suppliers, and semiconductor design software companies. Rising computational requirements and chip complexity support higher semiconductor content and manufacturing investment, although competition, cyclicality, export restrictions, and improving compute efficiency create risks.

Bull case

  • AI Compute and Inference Demand Accelerates: Expanding foundation models, agentic applications, reasoning-intensive inference, and enterprise AI deployment increase demand for GPUs, custom accelerators, CPUs, and specialized processors, supporting sustained semiconductor revenue growth and investment.

  • HBM and Advanced Manufacturing Bottlenecks Strengthen Supplier Economics: Increasing memory bandwidth requirements, leading-edge process complexity, and advanced packaging constraints support demand for HBM, foundry capacity, lithography, deposition, inspection, and chip assembly technologies, improving pricing power for critical suppliers.

  • Custom Silicon Expands the Semiconductor Opportunity: Hyperscalers increasingly develop proprietary accelerators to optimize performance and economics, broadening opportunities for ASIC designers, foundries, EDA providers, packaging specialists, and suppliers of differentiated semiconductor technologies beyond established GPU leaders.

Bear case

  • AI Capital Spending and Semiconductor Cyclicality: Disappointing AI monetization, reduced hyperscaler investment, or excess manufacturing capacity could weaken accelerator demand, reverse memory pricing gains, reduce equipment orders, and pressure semiconductor profitability.

  • Competitive Disruption and Rapid Technology Transitions: Custom ASICs, alternative computing architectures, open software ecosystems, and improving performance per watt could erode established market positions, compress accelerator pricing, and shorten product replacement cycles.

  • Geopolitical and Supply Chain Concentration Risks: Export restrictions, China-related trade tensions, Taiwan manufacturing concentration, limited advanced packaging capacity, and complex global supply chains could disrupt production, restrict market access, and increase costs across the AI semiconductor ecosystem.

Google_Sheets

Overview

Hiring Trend Watchpoints

1. Advanced Packaging & Heterogeneous Integration: Accelerated hiring for packaging R&D, through-silicon via (TSV) engineers, and hybrid bonding process specialists in Taiwan, South Korea, Japan, and US expansion hubs (e.g., TSMC Arizona, Micron Boise/Clay). Sustained job posting growth indicates readiness for HBM4 logic base die integration. 2. Memory Test and Metrology Engineers: Increased recruitment of automated test equipment (ATE) application engineers and high-speed probe card designers at firms like Teradyne, FormFactor, and Onto Innovation [cite: AI26_SemisMemo_Feb26.docx]. Growing test head engineering headcount signals yield-enhancement bottlenecks on high-layer stacks. 3. High-Speed Interface & Mixed-Signal IC Designers: Strong demand for physical layer (PHY), PCIe Gen 6/7, CXL 3.1, MRDIMM, and Silicon Photonics transceiver specialists across merchant silicon designers (Rambus, Silicon Motion, Tower Semiconductor partners) [cite: Ticker_DetailedOverview: TSEM, Ticker_DetailedOverview: SIMO, Ticker_DetailedOverview: RMBS]. 4. Fab Construction & Cleanroom Operations: Sustained headcount ramps for cleanroom technicians, facilities operations, and EUV lithography tooling engineers at greenfield memory and foundry sites. 5. Execution vs. Deterioration Signals: Requisition surges in advanced packaging yield analysis confirm strong thematic execution. Conversely, hiring freezes in fab operations, slowdowns in packaging technician postings, or cuts in merchant controller design teams would signal demand moderation or project delays.

Forum Watchlist

  • Reddit — r/semiconductorsHigh

    Process node transitions (2nm, A14), 1-gamma/1-delta DRAM roadmaps, packaging yields, and EUV tooling availability.

  • Reddit — r/hardwareMedium

    Server platform transitions (AMD Venice, Intel Diamond Rapids), DDR5 MRDIMM adoption, and enterprise SSD tiering discussions.

  • Blind — Semiconductor Professional NetworkHigh

    Talent movement across Micron, SK Hynix, TSMC, Samsung, and equipment vendors; internal chatter regarding HBM4 qualification and fab yield milestones.

  • SemiWiki — SemiWiki ForumHigh

    Deep architectural debates on hybrid bonding, foundry-manufactured HBM base dies, CoWoS capacity allocations, and co-packaged optics progress.

  • ServeTheHome — STH ForumsMedium

    Enterprise data center deployments, hyperscaler SSD qualification cycles, CXL pooling trials, and memory pricing sentiment.

Industry Publications

  • TrendForce (DRAMeXchange) (trendforce.com) — Benchmark provider of contract and spot pricing data, supply-demand balances, and bit shipment forecasts for HBM, DRAM, and enterprise NAND Flash [cite: Theme_Overview, 26].
  • SemiAnalysis (semianalysis.com) — In-depth technical architecture research analyzing HBM supply chains, CoWoS advanced packaging capacity, and hyperscaler accelerator roadmaps [cite: Ticker_DetailedOverview: CBRS].
  • Semiconductor Engineering (semiconductorengineering.com) — Deep analysis of manufacturing physics, advanced packaging packaging challenges, hybrid bonding, and memory test complexities [cite: Theme_Overview].
  • The Next Platform (nextplatform.com) — Rigorous coverage of high-performance computing, disaggregated data center memory topologies, optical interconnects, and AI infrastructure [cite: Ticker_DetailedOverview: CBRS].
  • TechInsights (techinsights.com) — Authoritative teardown and reverse engineering analysis of leading-edge memory dies, 3D packaging cross-sections, and semiconductor equipment billings [cite: Theme_Overview].

Second Order Trends

1. KV-Cache Tiering & Disaggregated Storage: As agentic workflows and multi-million token context windows scale, inferencing GPU clusters cannot keep entire KV caches in scarce HBM [cite: AI26_SemisMemo_Feb26.docx]. Hyperscalers are standardizing memory hierarchies where 'warm' KV caches spill over to DDR5 DRAM and ultra-fast QLC enterprise SSDs, turning NAND flash into an active inference tier rather than purely passive storage [cite: AI26_SemisMemo_Feb26.docx, Ticker_BullBearDetails: SNDK]. 2. Foundry-Fabricated HBM4 Base Dies: Moving beyond standard memory process bases, HBM4 and HBM4E adopt advanced foundry logic nodes (e.g., TSMC 3nm/4nm) for the base die, fusing logic and memory ecosystems and deepening co-design relationships between hyperscalers, foundries, and memory vendors [cite: Theme_BullBearDetails: MU]. 3. Silicon Photonics and Optical Engines Ramp: Cluster interconnect limits at 1.6T and 3.2T are transitioning data centers toward Near-Package Optics (NPO) and Co-Packaged Optics (CPO) [cite: Ticker_DetailedOverview: TSEM, Ticker_BullBearDetails: TSEM]. Specialty foundries and optical engine makers represent an expanding bottleneck beneficiary segment [cite: AI26_SemisMemo_Feb26.docx, Ticker_DetailedOverview: TSEM]. 4. Memory Testing as a Capital Equipment Bottleneck: As memory stacks reach 12-to-16 layers with microscopic microbump and hybrid bond pitches, the cost of packaging a defective die is catastrophic [cite: AI26_SemisMemo_Feb26.docx]. Spending on high-speed wafer testing, automated probe cards, and optical metrology (Teradyne, FormFactor, Onto Innovation) is expanding faster than wafer start volume [cite: AI26_SemisMemo_Feb26.docx]. 5. Commercial Transformation via Strategic Customer Agreements: Memory producers are successfully de-risking multi-billion dollar greenfield fab CapEx by securing non-cancellable, multi-year take-or-pay Strategic Customer Agreements (SCAs/NBMs) supported by substantial upfront customer deposits [cite: Theme_BullBearDetails, Ticker_DetailedOverview: SNDK].

Search Keywords Brand Product

  • HBM3E
  • HBM4
  • HBM4E
  • MRDIMM
  • DDR5 RCD
  • LPDDR5X SOCAMM2
  • MonTitan SSD
  • Stargate SSD
  • Wafer-Scale Engine 3
  • CV7 AI SoC
  • CoWoS
  • COUPE packaging
  • 1-gamma DRAM
  • 1-delta DRAM
  • BiCS8 NAND
  • Optimus SSD
  • Ferri SSD
  • Silicon Photonics transceiver
  • QLC Enterprise SSD
  • PCIe Gen 6
  • memory supercycle
  • AI semiconductor bottleneck
  • high bandwidth memory shortage
  • server DRAM pricing
  • advanced packaging capacity
  • AI memory wall
  • enterprise SSD demand
  • semicap subsystems
  • memory test equipment
  • agentic AI memory

Search Keywords Policy Regulatory

  • CHIPS Act funding
  • semiconductor export controls
  • AI memory trade restrictions
  • advanced packaging subsidies
  • US semiconductor tariffs

Search Keywords Event Phrases

  • SEMICON West
  • Flash Memory Summit
  • OFC Conference
  • TSMC OIP Ecosystem Forum
  • Hot Chips Conference
  • NVIDIA GTC

Google Trend Product Category Intent

• HBM memory • HBM4 • HBM3E • DDR5 RAM • enterprise SSD • MRDIMM • silicon photonics • CoWoS packaging • PCIe Gen 6 SSD • CXL memory

Google Trend Consumer Intent

• what is HBM memory • memory supercycle explained • AI chip shortage • AI server memory requirements • HBM vs DRAM • why are SSD prices rising • agentic AI hardware

Google Trend Macro Policy Terms

• CHIPS Act grants • semiconductor export restrictions • AI chip export ban • Taiwan semiconductor supply chain

Economic Data Watch

1. SEMI — Worldwide Semiconductor Equipment Market Statistics (WWSEMS)

Matchedsemi_semiconductor_equipment_billings · access=file · map_only

Metric/field Global Semiconductor Equipment Billings (3-month moving average, USD billions)

Cadence monthly

Why it matters Leading indicator for semiconductor capital expenditure and future production capacity, directly impacting semicap subsystem and advanced packaging segments.

Signal to watch Rising billings indicate increased investment and future capacity expansion.

Confidence: high

2. TrendForce — DRAM Monthly Datasheet / HBM Industry Analysis

Matchedtrendforce_supply_demand_industry_forecasts · access=file · map_only

Metric/field Blended ASP of HBM (USD)

Cadence quarterly

Why it matters Key indicator of memory supercycle health and pricing power for HBM, impacting profitability of memory manufacturers like Micron and SK Hynix.

Signal to watch Sustained ASP increases signal strong demand and tight supply.

Confidence: high

3. TrendForce — NAND Flash Monthly Datasheet / NAND Flash Industry Analysis

Matchedtrendforce_supply_demand_industry_forecasts · access=file · map_only

Metric/field Global NAND Flash Average Selling Price (ASP) (USD)

Cadence monthly

Why it matters Key indicator of NAND market health and pricing power, impacting profitability of SanDisk and Silicon Motion.

Signal to watch Rising ASP is bullish, indicating strong demand or constrained supply.

Confidence: high

4. WSTS — WSTS Historical Billings Report

Matchedsemi_semiconductor_equipment_billings · access=file · map_only

Metric/field Worldwide Semiconductor Sales - Total Sales Value (USD billions, 3-month moving average)

Cadence monthly

Why it matters Direct indicator of the overall health and growth of the semiconductor industry, which includes DRAM and NAND, impacting all theme constituents.

Signal to watch Sustained month-over-month and year-over-year growth indicates a healthy and expanding market.

Confidence: high

5. Dell'Oro Group — Data Center Physical Infrastructure Quarterly Reports

Matched (medium)dell_oro_group_network_equipment_market_share · access=file · map_only

Metric/field Worldwide Data Center Physical Infrastructure (DCPI) manufacturer revenue (USD billions)

Cadence quarterly

Why it matters Direct indicator of investment in AI infrastructure, which drives demand for advanced semiconductors, memory, and optical components.

Signal to watch Sustained year-over-year growth in DCPI revenue indicates strong AI infrastructure build-out.

Confidence: high

Free Alt Data Watch

1. Google Trends — Web Search Interest

Not in registry

Metric/field Interest over time for search term "HBM memory"

Cadence daily

Why it matters Reflects general public and industry interest in the core memory technology crucial for AI applications.

Signal to watch Rising interest suggests increasing awareness and potential demand.

Confidence: medium

2. SEC EDGAR — Company Filings

Not in registry

Metric/field Number of Form 8-K filings (or specific item numbers like 1.01, 2.02, 8.01) for key constituents

Cadence event_driven

Why it matters Provides timely information on significant company events, such as new product announcements, customer wins, or financial updates.

Signal to watch Filings detailing new partnerships, significant orders, or technology breakthroughs are bullish.

Confidence: high

3. USPTO PatentsView — Patent Grants

Matched (medium)cand_uspto_patentsview_75814015 · candidate

Metric/field Number of patent grants by assignee (e.g., Micron Technology, Samsung, SK Hynix, TSMC, Rambus)

Cadence monthly

Why it matters Indicates continued innovation and R&D activity in core semiconductor and memory technologies, crucial for competitive advantage.

Signal to watch Increasing number of relevant patent grants is bullish.

Confidence: high

4. Indeed Hiring Lab — Job Postings Data

Matchedindeed_food_service_postings · access=api

Metric/field Number of job postings for "HBM engineer" / "Silicon Photonics engineer"

Cadence weekly

Why it matters Reflects demand for specialized talent in key growth areas of the theme, indicating industry investment and expansion.

Signal to watch Sustained or increasing job postings are bullish, signaling industry growth.

Confidence: medium

5. Reddit — r/semiconductors subreddit activity

Matched (medium)wingstop_community_posts · access=scrape

Metric/field Post volume and sentiment related to HBM, advanced packaging, AI chips

Cadence weekly

Why it matters Gauges industry sentiment, emerging discussions, and potential early signals regarding technological developments and supply chain issues.

Signal to watch Increased positive sentiment or discussion volume around key technologies (e.g., HBM, advanced packaging) is bullish.

Confidence: medium

Paid Alt Data Watch

1. TrendForce — HBM Industry Analysis

Matchedtrendforce_technology_shipments_market_share · access=file · map_only

Metric/field HBM Market Share by Supplier (e.g., SK Hynix, Samsung, Micron)

Cadence quarterly

Why it matters Directly tracks competitive dynamics and market leadership in the critical HBM segment, which is central to the AI '25: Semis & Memory theme.

Signal to watch Increasing market share for theme constituents (e.g., Micron, SK Hynix, Samsung) is bullish.

Confidence: high

2. TechInsights — Memory Pricing Report

Matched (medium)techinsights_technology_pricing_benchmark_telecom_semiconductors · access=file · map_only

Metric/field HBM Price per GB by Generation (e.g., HBM3e, HBM4)

Cadence monthly

Why it matters Provides granular pricing data for HBM, a key driver of revenue and profitability for memory manufacturers.

Signal to watch Sustained or increasing price per GB for HBM generations is bullish.

Confidence: high

3. Sourceability — Lead Time Report

Matchedsourceability_component_pricing_lead_times · access=file · map_only

Metric/field Semiconductor Component Lead Times (e.g., DDR4, HBM, SSDs, Power Management ICs)

Cadence quarterly

Why it matters Indicates supply chain health and potential bottlenecks for critical components, directly impacting production and delivery for theme constituents.

Signal to watch Lengthening lead times for AI-related components (HBM, enterprise SSDs, power management) signal tight supply and strong demand.

Confidence: high

4. Yole Group — Advanced Packaging Market and Technology Report

Matchedyole_group_supply_chain_company_market_share · access=file · map_only

Metric/field Advanced Packaging Market Share Evolution (by technology, e.g., Flip-chip, FOWLP, 3D/2.5D)

Cadence irregular

Why it matters Advanced packaging is a critical bottleneck and growth area for AI chips. Tracking market share indicates adoption and competitive positioning.

Signal to watch Increasing market share for advanced packaging technologies (especially 3D/2.5D, FOWLP) is bullish.

Confidence: high

5. IDC / Gartner — Worldwide Server Market Share and Forecast

Matchedgartner_vendor_market_share_data · access=file · map_only

Metric/field Global Server Shipments (units) / AI Server Shipments (units)

Cadence quarterly

Why it matters Tracks underlying demand for data center infrastructure and AI servers, which are primary consumers of advanced semiconductors and memory. [cite: RMBS_Ticker_KeyFactors]

Signal to watch Sustained growth in global and AI server shipments is bullish for demand across the theme. [cite: RMBS_Ticker_KeyFactors]

Confidence: high

Prediction Market Watch

1. Will data center power-cost standards become law? (Before Jul 1, 2027)

Kalshi · Confidence: high

Matched (medium)kalshi_senate_control_d · access=api

Market https://kalshi.com/markets/kxratepayerlaw

Why it matters Data center power consumption is a critical factor for the expansion of AI infrastructure, which directly drives demand for semiconductors and memory. New power-cost standards could significantly impact the operational expenses and capital expenditure plans of hyperscalers and data center operators, who are major customers for theme constituents like Micron (MU), TSMC (2330.TW), SanDisk (SNDK), Cerebras (CBRS), and Rambus (RMBS). This directly relates to sector regulation and could influence program funding for new data center builds.

Series key pm_datacenter_power_cost_law

2. Which bills will become law in 2026?

Polymarket · Confidence: high

Not in registryaccess=api

Market https://polymarket.com/event/which-bills-will-become-law-in-2026

Why it matters The 'AI-chip export licensing' and 'Export-control chip security' contracts are directly relevant to the theme's thesis, specifically addressing geopolitical tensions and trade restrictions (Bear3). New export controls or licensing requirements on AI-related memory and semiconductors could severely disrupt global supply chains, limit market access, and negatively impact the profitability of key theme constituents such as TSMC (2330.TW), Micron (MU), and SK Hynix (000660.KO), which have significant international operations and sales exposure.

Series key pm_ai_chip_export_controls

3. Americas data center capacity at the end of 2026

Kalshi · Confidence: high

Matched (medium)kalshi_senate_control_d · access=api

Market https://kalshi.com/markets/kxusdccapacity

Why it matters The growth in data center capacity in the Americas is a direct indicator of the build-out of AI infrastructure, which is a primary driver for the 'AI '25: Semis & Memory' theme. Increased capacity signals higher demand for advanced semiconductors, HBM, DRAM, NAND, and related components from theme constituents like Micron (MU), TSMC (2330.TW), SanDisk (SNDK), and Rambus (RMBS). This directly impacts the 'massive capital intensity' (Bear1) and 'broadening AI applications' (Bull2) aspects of the theme.

Series key pm_americas_datacenter_capacity

Theme Plain English
This theme captures the critical hardware backbone enabling artificial intelligence beyond compute GPUs, centered on the accelerating memory supercycle and advanced semiconductor supply chain [cite: AI26_SemisMemo_Feb26.docx]. As generative and agentic AI models scale up context windows and inference workloads, high bandwidth memory (HBM), high-capacity DRAM, enterprise NAND flash, silicon photonics, and memory testing equipment become acute operational bottlenecks [cite: AI26_SemisMemo_Feb26.docx, Theme_BullBearDetails]. The theme tracks primary memory fabricators, packaging specialists, test subsystem providers, and high-speed interface chipmakers essential to resolving the memory wall [cite: AI26_SemisMemo_Feb26.docx, Ticker_DetailedOverview: RMBS].

LLM_Approved · Updated 2026-10-19

Key Metrics3 rows
MetricCadenceWhat It SignalsUpdate Source
Semiconductor Equipment Book-to-Bill RatioMonthlyIndicates demand strength in semiconductor manufacturing equipment, reflecting future production capacity.Google_Sheets
High Bandwidth Memory (HBM) Shipment VolumesQuarterlyTracks the demand and adoption rate of advanced memory solutions crucial for AI applications.Google_Sheets
AI Chip Revenue Growth RateQuarterlyMeasures the growth trajectory of revenue derived from AI-specific semiconductor products.Google_Sheets

SEMI Industry Association · Updated 2025-12-17

Upcoming Catalysts69 rows
CatalystEstimated TimingEstimated Date StartEstimated Date EndWhy It MattersTicker Or Theme SpecificSource TypesContributing TickersMention CountBase ScoreSource WeightSpecificity WeightMacro BridgeMacro Bridge MultiplierTheme ScoreDate AggregatedManual OverrideBridge Mention CountTheme Base ScoreTheme Importance ScoreSource TypeCatalyst SourceCatalyst IDTranscript Date
Major hyperscalers (Microsoft, Meta, Amazon, Alphabet) will report their Q3 2026 earnings, providing critical updates on AI capital expenditure plans and demand for AI infrastructure.Late October - Early November 20262026-10-222026-11-04These reports offer direct insights into the spending trends of the largest consumers of AI chips and memory, signaling future demand for advanced semiconductors, High Bandwidth Memory (HBM), and related components across the supply chain. This macro catalyst affects multiple constituent tickers by indicating the overall health and investment pace in AI infrastructure.Themetheme_composerMU, 2330.TW, RMBS, AMBA, 000660.KO, SNDK, SIMO77.87521.181.051.0975.74212026-08-05False12.0808257.8145Theme composer
The shipping and ramp-up of AMD's Zen 6 EPYC "Venice" server processors (9006 SP7 series) in Q4 2026 will drive demand for next-generation DDR5 and MRDIMM memory solutions in AI data centers.Q4 20262026-10-012026-12-31The introduction and ramp of new high-performance CPU platforms from AMD are key drivers for the adoption of advanced memory technologies and associated interface IP, directly impacting memory manufacturers (e.g., Micron, SK Hynix) and IP providers (e.g., Rambus).Themetheme_composerRMBS, MU, 2330.TW, 000660.KO48.59641.181.0Economic1.251267.97342026-08-05False11.4342211.5486Theme composer
Construction of a new assembly and test building on the Songdo campus in Korea remains on schedule for completion by the end of 2026.by the end of the year2026-10-012026-12-31This expansion provides critical cleanroom capacity to support growing data center and advanced packaging opportunities.Tickerearnings_transcriptAMKR (ticker)AMKR_635c90912026-07-27
Completion of the new test building in Korea, providing incremental space to support data center demand.at the end of this year2026-10-012026-12-31This expansion is critical to support the growing demand for data center applications and advanced packaging, alleviating potential capacity constraints going into 2027.Tickerearnings_transcriptAMKR (ticker)AMKR_4767d0b62026-04-27
Amkor to launch two new High-Density Fan-Out (HDFO) programs for AI data centers into high-volume production in Korea.second half of the year2026-07-012026-12-31This is critical for Amkor to achieve its projected nearly tripling of HDFO/2.5D revenue in 2026 and capitalize on AI/HPC demand, significantly impacting computing segment growth and overall revenue.Tickerearnings_transcriptAMKR (ticker)AMKR_525e36ea2026-02-09
Changes or new developments in export controls and trade policies, particularly between the U.S. and China, affecting AI products or semiconductor supply chains.closely monitoring2026-05-032027-05-03Could impact demand, supply chain dynamics, and market access for certain products, potentially affecting revenue or operational flexibility.Themeearnings_transcriptAMKR (ticker)AMKR_c57c3b022026-04-27
High-volume ramp of advanced packaging programs, including the new data center CPU program, in Korea.second half of the year2026-07-012026-12-31Successful ramps are crucial for achieving full-year revenue growth targets, especially the tripling of AI advanced packaging revenue, and improving utilization and margins. Delays would negatively impact results and sentiment.Tickerearnings_transcriptAMKR (ticker)AMKR_9c6e7aec2026-04-27
Start of 1.4-nanometer pilot-line tool orders in H2 2026 and subsequent ramp to high-volume manufacturing in 2027–2028 (ASM expects first pilot investments in H2 2026).In the second half of 2026 (pilot) with volume production in 2027–20282026-07-012028-12-31If pilot orders materialize and HVM ramps on schedule, ASM could capture the stated SAM uplift ($450–500M) and drive meaningful equipment revenue and higher-margin ALD/Epi sales; delays, fewer customers, or slower HVM would reduce near-term revenue/margin upside and delay 2027–2028 growth.Tickerearnings_transcriptASM.AS (ticker)ASM.AS_c570d3432025-10-29
Start of pilot line investments for the 1.4 nanometer node by customers, with potential for multiple customer commitments.second half of 20262026-07-012026-12-31This milestone indicates the pace of advanced node adoption and ASM's ability to capture significant served available market expansion, driving future revenue and market share. Bullish if multiple customers commit.Tickerearnings_transcriptASM.AS (ticker)ASM.AS_9dacb8d82026-03-03
Successful ramp of ASM's new Epi win in HBM-related DRAM and securing additional Epi design wins with other customers.starting this year in 2026 and hopefully in this year, too2026-01-012026-12-31This will drive healthy growth in ASM's advanced DRAM sales, expanding its presence in the high-growth HBM market and contributing to overall revenue and market share.Tickerearnings_transcriptASM.AS (ticker)ASM.AS_22394c742026-03-03
Achievement of performance targets by Axus Technology, triggering earnout payments up to EUR 30 million.over '26 and '272026-01-012027-12-31The payment indicates successful integration and performance of the acquired CMP technology, validating the strategic rationale and potential for advanced packaging market penetration.Tickerearnings_transcriptASM.AS (ticker)ASM.AS_6e0614e82026-03-03
Initial market launch of Co-Packaged Optics (CPO) products by customers.somewhere along the line towards the end of the year, the CPO will start launching2026-10-012026-12-31CPO is a critical technology for next-generation AI data centers, and its initial deployment will provide valuable performance and cost benchmarks, signaling broader market adoption and potential for ASE's related advanced packaging services. Bullish.Themeearnings_transcriptASX (ticker)ASX_96ea10422026-07-30
ASE's ATM (Assembly, Testing, and Materials) gross margin exceeding its structural ceiling of 30% in Q4 2026.fourth quarter ATM gross margin likely to exceed our structural margin ceiling of 30%2026-10-012026-12-31Surpassing this margin threshold indicates strong operating leverage, favorable revenue mix from LEAP services, and improved efficiency, which could lead to an upward revision of future margin guidance and positively impact profitability. Bullish.Tickerearnings_transcriptASX (ticker)ASX_cfeafcb22026-07-30
Clarity on mainstream adoption for HBM hybrid bonding (HBM4E and HBM3 applications) at major memory companies.H2 20262026-10-232026-12-31This catalyst is crucial for a significant high-margin growth wave for BESI.AS and validates the increasing complexity and demand for specialized equipment in advanced AI accelerators.Tickerearnings_transcriptBESI.AS (ticker)BESI.AS_59af3ba12026-10-22
Samsung Electronics is targeting mass production of its CXL Memory Module-DRAM (CMM-D) 3.0, based on the CXL 3.2 specification.Q4 20262026-10-012026-12-31Samsung's mass production of advanced CXL memory modules is a critical step for hyperscale adoption, directly enabling projects designed to eliminate stranded memory and improve data center efficiency. Cadence benefits as CXL chip designs utilize its EDA tools and CXL VIP, increasing EDA tool usage per design.Themeearnings_transcriptCDNS (ticker)CDNS_4c28e2422026-07-27
Completion of Process Design Kit (PDK) 0.9 for Intel 14A.October2026-10-012026-10-31This is a crucial technical milestone that validates the development progress of the 14A process, enabling external customer engagements and design commitments, which is bullish for Intel Foundry's future revenue.Tickerearnings_transcriptINTC (ticker)INTC_1e3a23d22026-07-23
Sustained strong double-digit unit growth in server CPU demand for the industry and Intel, with momentum continuing into 2027.strong year of double-digit unit growth for the industry and for us with momentum extending into 20272026-01-012027-12-31Robust server CPU demand, driven by AI infrastructure build-out, is a significant tailwind for Intel's Data Center and AI segment, positively impacting revenue and market position.Tickerearnings_transcriptINTC (ticker)INTC_d4d9e9982026-04-23
Applied Materials expects to achieve fiscal Q4 2026 revenue of $10.25 billion (midpoint) and non-GAAP EPS of $4.02 (midpoint).Fiscal Q4 2026 (ending October 2026)2026-08-012026-10-31Meeting or exceeding this strong guidance would validate the company's positive outlook and the impact of AI-driven demand on its financial performance, potentially boosting investor confidence.Tickerearnings_transcriptAMAT (ticker)AMAT_ff30d09b2026-08-13
Partnership with Hugging Face to include 1 year of Hugging Face Pro with Ryzen AI Halo systems.beginning later this year2026-10-012026-12-31This enhances the software ecosystem and developer experience for AMD's AI PCs, potentially driving adoption and competitive differentiation in the client segment.Tickerearnings_transcriptAMD (ticker)AMD_3640f50b2026-08-04
Ramp up of high-volume shipments of TPU version 8i to Google, accelerated shipments of Ironwood to Anthropic, continued shipments of Jalapeno for OpenAI, and production shipments of Meta's custom MTIA accelerator.Q4 20262026-09-012026-11-30These deployments are expected to drive Q4 AI revenue to $21.7 billion, up 236% year-on-year, demonstrating strong execution and demand in their key AI semiconductor business.Tickerearnings_transcriptAVGO (ticker)AVGO_d6960b6c2026-09-02
Broadcom beginning production of silicon for OpenAI's AI accelerators.production late 20262026-10-012026-12-31This marks a significant milestone in Broadcom's partnership with OpenAI, a major AI frontier lab, and is crucial for its projected AI semiconductor revenue growth in 2027 and beyond.Tickerearnings_transcriptAVGO (ticker)AVGO_3121e94d2026-06-03
Execution and delivery of an $11 billion order of TPU 'ironwood' racks to Anthropic (management stated the $11B order is for delivery in late 2026).delivery in late 20262026-10-012026-12-31Successful on-time delivery drives revenue recognition, backlog conversion and AI semiconductor/networks revenue in 2026; delays, cancellations or supply constraints would reduce near-term revenue and could worsen concentration risk and investor sentiment.Tickerearnings_transcriptAVGO (ticker)AVGO_f8456d4a2025-12-11
Delivery and execution of a $1 billion order from Broadcom's fifth XPU (customer accelerator) customer, noted as for delivery in late 2026.delivery in late 20262026-10-012026-12-31Adds to AI backlog conversion and customer diversification; on-time execution supports FY2026 revenue and cementing design-win momentum, while delays or cancellations would reduce expected AI revenue and weaken investor confidence in broadening customer base.Tickerearnings_transcriptAVGO (ticker)AVGO_98b78f532025-12-11
Broadcom has fully secured capacity for leading-edge wafers, high-bandwidth memory and substrates for 2026–2028.for 2026 through 20282026-01-012028-12-31Mitigates supply constraints risk and provides visibility into delivery timelines and backlog, supporting investor confidence in growth trajectory.Tickerearnings_transcriptAVGO (ticker)AVGO_c6986cdd2026-03-04
Delivery of GPU‑accelerated EDA/Ansys products and Omniverse integrations under the NVIDIA partnership (management expects 'a number' of these products to be delivered in 2026).in 20262026-01-012026-12-31GPU-accelerated tools and Omniverse connectors could materially improve performance, customer value and pricing power (bullish); failure to ship meaningful GPU-accelerated offerings or limited customer uptake would undermine expected product differentiation and upside from the NVIDIA partnership (bearish).Tickerearnings_transcriptSNPS (ticker)SNPS_3fc73aac2026-02-25
Availability and customer monetization (tape-outs/licenses) of key Design IP titles (HPC/interface IP) that management said are on track and expected to be Q4‑weighted.a little bit more Q4 weighted / toward the latter part of the year2026-08-012026-10-31On‑time, silicon‑proven delivery and monetization would drive the expected back‑half recovery in the IP segment and reduce the 'transitional year' risk (bullish); further delays would keep IP revenue muted, pressuring FY26 growth and margins (bearish).Tickerearnings_transcriptSNPS (ticker)SNPS_312412002026-02-25
Execution (timing and magnitude) of the newly replenished $2.0 billion stock repurchase authorization the Board approved following term‑loan repayment.Board authorized to purchase up to $2 billion (opportunistic repurchases)2026-02-252026-10-31Material repurchases would reduce share count and be EPS‑accretive and signal confidence in cash generation (bullish); minimal or delayed repurchases (or diversion of cash to other uses) would reduce the near‑term EPS lift and could signal more conservative capital allocation (bearish).Tickerearnings_transcriptSNPS (ticker)SNPS_c4a5d7662026-02-25
Commercial availability ramp of Multiphysics Fusion technology, with monetization expected to start in fiscal year 2027.second half of 20262026-07-012026-12-31This product ramp is expected to drive meaningful productivity gains for customers and allow Synopsys to share in value creation, impacting EDA revenue and margins, and contributing to Ansys revenue synergies.Tickerearnings_transcriptSNPS (ticker)SNPS_4e16e4392026-05-27
Signing of agreements with a few customers for a new, higher-value IP business model, particularly with hyperscalers for HPC and AI-based chips.by the end of this fiscal year [FY26]2026-06-102026-10-31These initial agreements are crucial proof points for the new IP monetization strategy, aiming to capture more value and accelerate growth in the IP segment, positively impacting revenue and margins.Tickerearnings_transcriptSNPS (ticker)SNPS_503817f42026-05-27
Evolution of the monetization model for AI-driven EDA capabilities to a subscription-plus-consumption model.as agents become more pervasive in our customers' workflow2026-06-102027-12-31A successful shift to a new monetization model for agentic AI could significantly increase value capture and drive higher revenue and margins for the EDA and S&A businesses.Tickerearnings_transcriptSNPS (ticker)SNPS_9fff1ee62026-05-27
Conversion of Intel Foundry and other advanced node evaluations into production commitments for Synopsys IP.as these wins move from an eval into production2026-06-102027-12-31This would provide upside to IP revenue beyond current guidance, as Synopsys gets paid once customers commit to production, signaling strong demand for their foundational and interface IP at advanced nodes.Tickerearnings_transcriptSNPS (ticker)SNPS_03c563942026-05-27
SK Hynix's Q3 2026 earnings report will offer vital insights into High Bandwidth Memory (HBM) and DRAM average selling prices, demand trends, and production capacity, significantly influencing the memory supercycle.Late October 20262026-10-272026-10-27As a major HBM and DRAM producer, SK Hynix's results provide a critical read-through on the supply-demand balance and pricing power within the AI-driven memory market, directly impacting competitors like Micron and the broader memory supply chain.Themetheme_composer000660.KO, MU, RMBS37.82051.181.051.0968.9582026-08-05False10.796598.6813Theme composer
NVIDIA's GAAP and non-GAAP gross margins are expected to bottom in the 71% to 72% range.bottom in Q42026-11-012027-01-31This provides clarity on the expected trough for gross margins due to rising memory pricing, with a subsequent recovery anticipated in fiscal year '28, which is bullish for future profitability.Tickerearnings_transcriptNVDA (ticker)NVDA_b82277c42026-08-26
Broadcom's actual AI semiconductor revenue for fiscal year 2027 compared to its reiterated guidance of 'in excess of $100 billion'.fiscal year 272026-11-012027-10-31This ambitious long-term target is a major driver of Broadcom's valuation. Achieving or exceeding it would be a significant bullish catalyst, while any shortfall could materially impact investor sentiment.Tickerearnings_transcriptAVGO (ticker)AVGO_539a54992026-06-03
Initial revenue recognition / commercial sales from Synopsys‑Ansys joint solutions, which management expects to begin in fiscal 2027.monetization of the joint solution to start in FY '272026-11-012027-10-31If monetization begins in FY27 as guided, it provides an early revenue tail to justify merger rationale and the stated revenue synergies; failure to monetize on schedule would delay revenue upside and weaken the merger ROI thesis (bearish).Tickerearnings_transcriptSNPS (ticker)SNPS_db23c6612026-02-25
Announcement of the new rate and pace of Micron's capital return program, primarily share repurchases.from December 9th, which is the second anniversary of our CHIPS agreement signature2026-12-092026-12-31A higher-than-expected increase in share repurchases would be bullish for investor sentiment and valuation, signaling management's confidence and commitment to shareholder returns. A lower-than-expected increase could be bearish.Tickerearnings_transcriptMU (ticker)MU_7f312c232026-06-24
Commencement of increased capital return, primarily through share repurchases.starting December 9th2026-12-092026-12-09This signals Micron's commitment to shareholder returns and reflects strong financial health and confidence in future cash flow, which could positively impact investor sentiment.Tickerearnings_transcriptMU (ticker)MU_c63cecc42026-09-30
Reset of HBM pricing for calendar year 2027 to narrow the profitability gap with conventional DRAM.at the beginning of the calendar year2027-01-012027-01-01This pricing adjustment aims to improve HBM segment margins and overall profitability, capitalizing on strong demand for HBM.Tickerearnings_transcriptMU (ticker)MU_68c120be2026-09-30
Volume ramp of HBM4E, Micron's next-generation High Bandwidth Memory product.calendar 20272027-01-012027-12-31A successful HBM4E ramp is essential for Micron to maintain its leadership in the HBM market, capture future AI accelerator demand, and drive high-margin revenue growth, solidifying its position as a key AI enabler.Tickerearnings_transcriptMU (ticker)MU_ddbf85f02026-03-18
Micron's HBM4E product begins volume ramp.volume expected to ramp in calendar 20272027-01-012027-12-31Successful and timely volume ramp of HBM4E is critical for Micron to maintain its technology leadership and capture high-value AI-driven demand, impacting revenue, market share, and margins. Delays or yield issues would be bearish.Tickerearnings_transcriptMU (ticker)MU_b3fcf2382026-06-24
Micron's Singapore advanced packaging facility for HBM contributing meaningfully to HBM supply.calendar year 20272027-01-012027-12-31Increased HBM packaging capacity is a critical enabler for scaling HBM production to meet robust AI-driven demand, directly influencing Micron's HBM revenue and profitability.Tickerearnings_transcriptMU (ticker)MU_233065c22026-03-18
Meaningful contribution to HBM supply from Micron's Singapore HBM advanced package facility.calendar 20272027-01-012027-12-31The successful ramp and meaningful contribution of this facility are crucial for scaling HBM supply and realizing operational synergies. Delays would impact HBM capacity and potentially market share.Tickerearnings_transcriptMU (ticker)MU_b8c38d5c2025-12-17
Continued tight supply-demand conditions for both DRAM and NAND across the industry.beyond calendar 20262027-01-012027-12-31Persistent industry supply constraints are a key driver for strong memory pricing and high gross margins, benefiting Micron's profitability, but could also limit overall bit shipment growth.Themeearnings_transcriptMU (ticker)MU_de754c9c2026-03-18
Operating income margin dilution of approximately 1% to 2% due to depreciation and start-up costs for the Arizona facility, recognized in OpEx.beginning in 20272027-01-012027-12-31This will temporarily impact profitability and operating income margins in 2027 before the facility scales and contributes meaningful revenue and higher margins in later years.Tickerearnings_transcriptAMKR (ticker)AMKR_f52a5d0d2026-04-27
Completion of Phase 1 construction of the Arizona advanced packaging campus.planned to be completed in 20272027-01-012027-12-31This milestone is essential for bringing the new U.S. manufacturing capacity online, which is a key part of Amkor's long-term strategic expansion and geographic diversification. Delays would impact future revenue ramps.Tickerearnings_transcriptAMKR (ticker)AMKR_2314b2102026-04-27
Amkor to receive government incentives, including investment tax credits and grants, for its Arizona advanced packaging facility.come in on a lag2027-01-012027-12-31These incentives are a significant funding source (upwards of $2.85 billion) for the multi-billion dollar Arizona project, mitigating financial risk and improving return on investment.Tickerearnings_transcriptAMKR (ticker)AMKR_a6d1ab7a2026-02-09
Completion of the new Scottsdale facility, enabling substantial expansion of ALD and Epi product development activity.first quarter of 20272027-01-012027-03-31This expansion is crucial for ASM's innovation pipeline, supporting the development of next-generation technologies and securing future design wins and market leadership.Tickerearnings_transcriptASM.AS (ticker)ASM.AS_2f4db00d2026-03-03
Start of production for ASE's fully automated 310x310 panel process line.start production by Q1 of next year2027-01-012027-03-31This milestone represents a significant advancement in ASE's manufacturing capabilities for advanced packaging, enabling higher efficiency and scalability crucial for meeting the growing demand from AI applications and improving margins. Bullish.Tickerearnings_transcriptASX (ticker)ASX_187b94f72026-07-30
Fully automated 310x310mm panel process line commencing production.Q1 of next year2027-01-012027-03-31This new production line will significantly expand capacity for advanced packaging, directly supporting the scaling of HBM-integrated AI accelerators and contributing to high-margin potential.Tickerearnings_transcriptASX (ticker)ASX_8d5018ce2026-07-30
Conclusion of Besi's 16-week strategic review with key customers.early January2027-01-012027-01-31This review will provide clearer insights into customer roadmaps and Besi's strategic direction, potentially leading to updated market outlooks and investment plans for the next three to five years.Tickerearnings_transcriptBESI.AS (ticker)BESI.AS_45b82ef92026-10-22
Launch of Intel's Coral Rapid CPUs, featuring multithreading capabilities.Coral Rapid is coming up strong2027-01-012028-12-31This product is critical for Intel's competitive positioning against AMD in the server CPU market, potentially leading to market share gains and improved Data Center and AI (DCAI) performance.Tickerearnings_transcriptINTC (ticker)INTC_5990c1d52026-04-23
Intel's commitment to retire $3.8 billion in debt maturities coming due in 2027.20272027-01-012027-12-31Successful debt retirement strengthens the balance sheet and reduces future interest expense, signaling financial discipline; failure to do so would be bearish for credit ratings and investor confidence.Tickerearnings_transcriptINTC (ticker)INTC_d1ea1eec2026-04-23
Volume production for TSMC's new 3nm fab in Tainan Science Park is well on track to begin.first half of 20272027-01-012027-06-30This milestone significantly increases 3nm capacity in Taiwan, crucial for meeting robust customer demand and reinforcing TSMC's manufacturing leadership and revenue growth.Tickerearnings_transcriptTSM (ticker)TSM_85eaf1742026-10-15
Volume production of the new 3-nanometer fab in Tainan Science Park, Taiwan.first half of 20272027-01-012027-06-30This is a bullish factor, as it will increase N3 capacity to meet strong AI demand and support future revenue growth.Tickerearnings_transcriptTSM (ticker)TSM_3e406e442026-04-16
Volume production commencement for the new 3-nanometer fab in Tainan Science Park.first half of 20272027-01-012027-06-30This milestone will increase 3nm capacity, addressing strong AI-driven demand and potentially boosting revenue for TSMC.Tickerearnings_transcriptTSM (ticker)TSM_9b9acdbe2026-04-15
TSMC securing manufacturing business for a customer's next-generation LPU (Logic Processing Unit) product.next-generation LPU2027-01-012029-12-31Bullish for market share and revenue if successful, demonstrating continued technology leadership and customer trust in a competitive segment.Tickerearnings_transcriptTSM (ticker)TSM_3a42201a2026-04-16
Execution of the multi‑year alignment/agreement with OpenAI to support ~10 gigawatts of capacity across the 2027–2029 timeframe (management referenced the 10 GW alignment running through '27–'29).2027 through 20292027-01-012029-12-31If executed as anticipated, this multi-year power/build program could represent a material multi-year demand stream for Broadcom systems/components; if it under‑delivers or is delayed, expected medium-term revenue and visibility into large hyperscaler demand would be impaired.Tickerearnings_transcriptAVGO (ticker)AVGO_2a830b862025-12-11
Broadcom management stated line-of-sight to AI revenue from chips, just chips, exceeding $100 billion in 2027.in excess of $100 billion in 20272027-01-012027-12-31If realized, it represents a multi-year, high-scale AI compute monetization that could meaningfully lift revenue and inform valuation, though it may pressure margins if AI mix grows faster than mix shifts in other segments.Tickerearnings_transcriptAVGO (ticker)AVGO_bfe6a0532026-03-04
OpenAI deploying in volume their first-generation XPU in 2027 at over 1 gigawatt of compute capacity.in 20272027-01-012027-12-31OpenAI demand is a key driver for Broadcom's XPUs; a meaningful ramp would support backlog realization and top-line growth, though execution risk and timing remain uncertain.Tickerearnings_transcriptAVGO (ticker)AVGO_6fd62a9a2026-03-04
Next-generation Tomahawk 7 switch featuring 2x the performance.in 20272027-01-012027-12-31Higher bandwidth networking leadership supports AI compute expansion and could accelerate share gains in AI networking.Tickerearnings_transcriptAVGO (ticker)AVGO_ed84ae9b2026-03-04
NVIDIA's actual full-year FY27 non-GAAP gross margin performance relative to the 'mid seventies' target.For the full year2027-01-252027-01-25Gross margin performance is a key indicator of profitability. Sustaining margins in the mid-70s would be positive, while a decline could signal increasing input costs or competitive pressures, impacting valuation.Tickerearnings_transcriptNVDA (ticker)NVDA_a8c424942026-05-20
NVIDIA's actual full-year FY27 operating expense growth compared to the 'upper forties' guidance.For the full year2027-01-252027-01-25Operating expense growth exceeding or falling below the guidance could materially impact NVIDIA's profitability and gross margins, influencing investor sentiment.Tickerearnings_transcriptNVDA (ticker)NVDA_c2444d3e2026-05-20
First wafer output from Micron's first Idaho fab, accelerated to mid-calendar 2027.mid-calendar 20272027-05-012027-06-30Achieving this accelerated milestone demonstrates strong execution and is crucial for adding long-term supply capacity to meet persistent demand. Delays would signal execution challenges and impact future supply.Tickerearnings_transcriptMU (ticker)MU_df787b412025-12-17
Initial wafer output from Micron's first manufacturing fab in Idaho.mid-calendar 20272027-05-012027-06-30This milestone signifies the activation of new domestic production capacity, crucial for long-term supply expansion and potentially benefiting from government incentives like the CHIPS Act.Tickerearnings_transcriptMU (ticker)MU_6fcf0e642026-03-18
Micron begins initial wafer output from its first Idaho fab.mid-calendar 20272027-05-012027-06-30Successful and timely initial wafer output is crucial for increasing DRAM supply and meeting future demand. Delays or lower-than-expected yields could exacerbate supply constraints and negatively impact cost per bit and revenue.Tickerearnings_transcriptMU (ticker)MU_f544d3502026-06-24
CoWoS pilot line reaching maturity for production.about another one year to be mature so we can put it into the production with our customer.2027-07-012027-07-31This milestone would enable TSMC to address the tight advanced packaging capacity, supporting customer growth in AI and HPC, and potentially alleviating a key bottleneck for future revenue.Tickerearnings_transcriptTSM (ticker)TSM_91640f5f2026-07-16
Volume production will begin at TSMC's second 3nm fab in Arizona, slightly ahead of the previous schedule.third quarter 20272027-07-012027-09-30This accelerates overseas capacity expansion, addressing strong customer demand in the U.S. and potentially mitigating geopolitical supply chain risks.Tickerearnings_transcriptTSM (ticker)TSM_37699d9f2026-10-15
The Tongluo manufacturing site (acquired from Powerchip Semiconductor) beginning to support meaningful product shipments.beginning in fiscal 20282027-09-012028-08-31This new fab capacity is crucial for addressing long-term memory demand and increasing Micron's overall supply, which will directly impact future revenue growth and market share.Tickerearnings_transcriptMU (ticker)MU_a7963dc22026-03-18
Next-step upgrade to 400G SerDes in 2028.in 20282028-01-012028-12-31400G SerDes upgrade enables higher bandwidth within data-center clusters; could influence ASPs, mix and gross margins during the transition period.Tickerearnings_transcriptAVGO (ticker)AVGO_c74214d32026-03-04

LLM_Approved · Updated 2026-10-23

NotesTable

Earnings Summary

DateTypeCommentDetailSentimentTickers
2026-08-05Theme UpdateThe theme refresh reinforces the accelerating memory supercycle, driven by HBM demand for agentic AI and long-context models. Beyond HBM OEMs, the focus expands to second-order beneficiaries like memory testing (FORM, ONTO, TER), semicap subsystems, and silicon photonics. Increasing complexity necessitates deeper supply chain understanding to identify overlooked opportunities, despite persistent supply constraints.

Earnings Summary

BullishFORM, ONTO, TER, MU, 000660.KO, 2330.TW

LLM_Approved · Updated 2026-08-05

News

1 story tagged to this theme — Narrative Radar and editorial picks.

September 2026

Constituents

  • NVDAT15.0%
    — NVIDIA Corporation
  • MRVLT14.5%
    — Marvell Technology, Inc.
  • MUT13.0%
    — Micron Technology, Inc.
  • 000660.KOT2
    — SK hynix Inc.
  • 005930.KOT2
    — Samsung Electronics Co., Ltd.
  • AMKRT2
    — Amkor Technology, Inc.
  • ASM.AST2
    — ASM International N.V.
  • ASXT2
    — ASE Technology Holding Co., Ltd.
  • BESI.AST2
    — BE Semiconductor Industries N.V.
  • CDNST2
    — Cadence Design Systems, Inc.
  • INTCT2
    — Intel Corp.
  • KLACT2
    — KLA Corporation
  • RMBST2
    — Rambus Inc.
  • TSMT2
    — Taiwan Semiconductor Manufacturing Company Limited
  • 2454.TWT3
    — MediaTek Inc.
  • AMATT3
    — Applied Materials, Inc.
  • AMDT3
    — Advanced Micro Devices, Inc.
  • ASMLT3
    — ASML Holding N.V.
  • AVGOT3
    — Broadcom Inc.
  • GFST3
    — GLOBALFOUNDRIES Inc.
  • LRCXT3
    — Lam Research Corporation
  • QCOMT3
    — QUALCOMM Incorporated
  • SNPST3
    — Synopsys, Inc.
  • 8035.TT3
    · no notes yet
  • ARMT3
    · no notes yet